Bobbins (Coil Formers), Mounts, Hardware

Part Number	Description / PDF	Quantity
B65526B1010T001 TDK EPCOS	BOBBIN COIL FORMER ER 11 X 5	0
B66390A1016T001 TDK EPCOS	BOBBIN COIL FORMER E 36X18X11	227
B65672B0000T001 TDK EPCOS	BOBBIN COIL FORMER P 26 X 16	542
B66308B1108T001 TDK EPCOS	BOBBIN COIL FORMER E 16 X 8 X 5	1802
B65806N1106D002 TDK EPCOS	COIL FORMER RM5 SUMIKON PM 9630	215
B65806D2005X000 TDK EPCOS	INSULATING WASHER RM 5	4178
B65844X1010D002 TDK EPCOS	BOBBIN COIL FORMER EP 13	0
B65687A1018T001 TDK EPCOS	BOBBIN COIL FORMER PM 74 X 59	5
B66206W1110T001 TDK EPCOS	BOBBIN COIL FORMER E 20 X 10 X 6	3572
B66252B0000M001 TDK EPCOS	FERRITE CORES	250
B65846S2000X000 TDK EPCOS	MOUNTING ASSEMBLY EP 17	195
B65714J1000T001 TDK EPCOS	BOBBIN COIL FORMER PM 87 X 70	19
B66288F2204X000 TDK EPCOS	CLAMP ELP 32X6X20 I 32X3X20	2589
B65814N1012D001 TDK EPCOS	BOBBIN COIL FORMER RM 10	968
B65822J1008T001 TDK EPCOS	BOBBIN COIL FORMER RM 5	640
B66414B6008T001 TDK EPCOS	BOBBIN COIL FORMER EFD 15X8X5	787
B65821C1008T001 TDK EPCOS	BOBBIN COIL FORMER RM 6	2647
B65734B1000T001 TDK EPCOS	BOBBIN COIL FORMER PM 114 X 93	23
B65804C2005X000 TDK EPCOS	INSULATING WASHER RM 4	467
B66388A2000T001 TDK EPCOS	BOBBIN COIL FORMER E 65X32X27	0

Bobbins (Coil Formers), Mounts, Hardware

1. Overview

Bobbins (coil formers), mounts, and hardware are critical mechanical components in magnetic devices. Bobbins serve as structural supports for wound coils in transformers and inductors, while mounts/hardware ensure mechanical stability and electrical connectivity. These components enable precise winding alignment, thermal management, and electromagnetic interference (EMI) control, playing a vital role in power electronics, automotive systems, and industrial equipment.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Transformer Bobbins	Provide winding support with insulation barriers	Switch-mode power supplies (SMPS), AC/DC converters
Inductor Coil Formers	Enable precise winding geometry for inductance control	DC/DC converters, EMI filters
PCB Mounts	Secure components to printed circuit boards	Telecom equipment, automotive ECUs
Core Clamps	Mechanical fixation for ferrite/powder cores	High-frequency transformers, PFC circuits

3. Structure and Composition

Typical bobbin structures include:

Central core with winding windows
Insulation barriers (e.g., UL-certified materials)
Termination options: PCB pins, wire terminals
Thermal vias for heat dissipation

Mounts/hardware feature:

Anti-vibration rubber
Corrosion-resistant platings (nickel, zinc)
Adjustable positioning brackets

4. Key Technical Specifications

Parameter	Importance
Temperature Resistance (130-200 C)	Determines thermal stability and lifespan
Dielectric Strength (>2kV)	Ensures safety isolation between windings
Dimensional Tolerance ( 0.05mm)	Impacts winding machine compatibility
Tensile Strength (>50MPa)	Prevents mechanical deformation under load
Surface Resistivity (10^12 )	Prevents leakage current paths

5. Application Fields

Power Electronics: 5G base station PSUs, solar inverters
Automotive: On-board chargers (OBC), 48V DC/DC converters
Industrial: CNC machine power supplies, motor drives
Consumer: Fast chargers, LED drivers

6. Leading Manufacturers

Manufacturer	Representative Products
TDK-Lambda	Compact PCB-mount bobbin series for telecom
Sumec Corporation	High-temp composite coil formers
Eaton Electronics	Vibration-resistant inductor mounts
Fastron IC	Customizable toroidal core hardware kits

7. Selection Guidelines

Key considerations:

Material compatibility with expected operating temperatures
Dimensional matching to core geometries (ETD, PQ, RM types)
Vibration resistance for automotive applications
RoHS compliance for environmental regulations
Cost optimization through standard vs. customized designs

Case Study: Electric vehicle chargers use high-temperature bobbins (UL 1557 recognized) to withstand 150 C continuous operation.

8. Industry Trends

Emerging developments include:

Miniaturization through liquid crystal polymer (LCP) materials
Integrated cooling channels in bobbin designs
Smart mounts with embedded temperature sensors
Increased adoption of 3D-printed custom hardware

Market drivers: Electrification of transportation, 5G infrastructure deployment, and energy-efficient appliance standards.