Bobbins (Coil Formers), Mounts, Hardware

Part Number	Description / PDF	Quantity
B65545B0010X000 TDK EPCOS	YOKE P 14 X 8	311
B65844W1010D001 TDK EPCOS	BOBBIN COIL FORMER EP 13	666
B64291A1404X000 TDK EPCOS	HOUSING HORIZONTAL TOROIDS	300
B65820B2001X000 TDK EPCOS	CLAMP RM 7	500
B65804B6010T001 TDK EPCOS	BOBBIN COIL FORMER RM 4	2154
B65804P2204X000 TDK EPCOS	CLAMP RM 4	4871
B66418B2000X000 TDK EPCOS	YOKE EFD 20 X 10 X 7	448
B65532B0000T001 TDK EPCOS	BOBBIN COIL FORMER P 11 X 7	1057
B65527A2000X000 TDK EPCOS	YOKE ER 9.5 X 5	1599
B65655B0009X000 TDK EPCOS	MOUNTING ASSEMBLY P 18 X 11	499
B65880E0012D001 TDK EPCOS	BOBBIN COIL FORMER PQ 32 X 20	647
B65844S2000X000 TDK EPCOS	MOUNTING ASSEMBLY EP 13	761
B65808B2203X000 TDK EPCOS	CLAMP RM 6	17649
B65816A2002X000 TDK EPCOS	CLAMP RM 12	832
B66359B1013T001 TDK EPCOS	BOBBIN COIL FORMER ETD 29X16X10	0
B65652B0000T001 TDK EPCOS	BOBBIN COIL FORMER P 18 X 11	0
B64291A1204X000 TDK EPCOS	HOUSING HORIZONTAL TOROIDS	0
B65840B1006D002 TDK EPCOS	BOBBIN COIL FORMER EP 7	1695
B65840B1006D001 TDK EPCOS	BOBBIN COIL FORMER EP 7	2284
B65804N1206D001 TDK EPCOS	COIL FORMER RM4LP SUMIKON PM 963	0

Bobbins (Coil Formers), Mounts, Hardware

1. Overview

Bobbins (coil formers), mounts, and hardware are critical mechanical components in magnetic devices. Bobbins serve as structural supports for wound coils in transformers and inductors, while mounts/hardware ensure mechanical stability and electrical connectivity. These components enable precise winding alignment, thermal management, and electromagnetic interference (EMI) control, playing a vital role in power electronics, automotive systems, and industrial equipment.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Transformer Bobbins	Provide winding support with insulation barriers	Switch-mode power supplies (SMPS), AC/DC converters
Inductor Coil Formers	Enable precise winding geometry for inductance control	DC/DC converters, EMI filters
PCB Mounts	Secure components to printed circuit boards	Telecom equipment, automotive ECUs
Core Clamps	Mechanical fixation for ferrite/powder cores	High-frequency transformers, PFC circuits

3. Structure and Composition

Typical bobbin structures include:

Central core with winding windows
Insulation barriers (e.g., UL-certified materials)
Termination options: PCB pins, wire terminals
Thermal vias for heat dissipation

Mounts/hardware feature:

Anti-vibration rubber
Corrosion-resistant platings (nickel, zinc)
Adjustable positioning brackets

4. Key Technical Specifications

Parameter	Importance
Temperature Resistance (130-200 C)	Determines thermal stability and lifespan
Dielectric Strength (>2kV)	Ensures safety isolation between windings
Dimensional Tolerance ( 0.05mm)	Impacts winding machine compatibility
Tensile Strength (>50MPa)	Prevents mechanical deformation under load
Surface Resistivity (10^12 )	Prevents leakage current paths

5. Application Fields

Power Electronics: 5G base station PSUs, solar inverters
Automotive: On-board chargers (OBC), 48V DC/DC converters
Industrial: CNC machine power supplies, motor drives
Consumer: Fast chargers, LED drivers

6. Leading Manufacturers

Manufacturer	Representative Products
TDK-Lambda	Compact PCB-mount bobbin series for telecom
Sumec Corporation	High-temp composite coil formers
Eaton Electronics	Vibration-resistant inductor mounts
Fastron IC	Customizable toroidal core hardware kits

7. Selection Guidelines

Key considerations:

Material compatibility with expected operating temperatures
Dimensional matching to core geometries (ETD, PQ, RM types)
Vibration resistance for automotive applications
RoHS compliance for environmental regulations
Cost optimization through standard vs. customized designs

Case Study: Electric vehicle chargers use high-temperature bobbins (UL 1557 recognized) to withstand 150 C continuous operation.

8. Industry Trends

Emerging developments include:

Miniaturization through liquid crystal polymer (LCP) materials
Integrated cooling channels in bobbin designs
Smart mounts with embedded temperature sensors
Increased adoption of 3D-printed custom hardware

Market drivers: Electrification of transportation, 5G infrastructure deployment, and energy-efficient appliance standards.