Bobbins (Coil Formers), Mounts, Hardware

Part Number	Description / PDF	Quantity
B66302D1008T001 TDK EPCOS	BOBBIN COIL FORMER E 8.8	0
B65884E1012D001 TDK EPCOS	COIL FORMER PQ40/40 SUMIKON PM 9	0
B66206K1106T002 TDK EPCOS	BOBBIN COIL FORMER EF20 X 6-2	0
B65812N1012D002 TDK EPCOS	BOBBIN COIL FORMER RM8 2 SECTION	0
B65812P2203X000 TDK EPCOS	CLAMP RM 8	1432
B66301B1004T001 TDK EPCOS	BOBBIN COIL FORMER E 6.3	0
B65518D2002X000 TDK EPCOS	MOUNTING ASSEMBLY P 9 X 5	180
B65820W1008D002 TDK EPCOS	BOBBIN COIL FORMER RM 7	0
B65623A0001X000 TDK EPCOS	MOUNTING ASSEMBLY P 41 X 25	0
B65812N1005D002 TDK EPCOS	BOBBIN COIL FORMER RM 8	22
B66286A2000X000 TDK EPCOS	FERRITE CORES	1373
B66206A2010X000 TDK EPCOS	YOKE E 20 X 10 X 6	1188
B66301B1006T001 TDK EPCOS	BOBBIN COIL FORMER E 6.3	0
B65812N1108D002 TDK EPCOS	COILFORMER RM8 SUMIKON PM 9630	199
B65806N1106D001 TDK EPCOS	COIL FORMER RM5 SUMIKON PM 9630	503
B65512C0000T001 TDK EPCOS	BOBBIN COIL FORMER P 7 X 4	4200
B65808N1005D001 TDK EPCOS	BOBBIN COIL FORMER RM 6	828
B65695A20000X TDK EPCOS	FERRITE CORES	0
B65814N1012D002 TDK EPCOS	COIL FORMER RM10 SUMIKON PM 9630	0
B66456A1012T001 TDK EPCOS	BOBBIN COIL FORMER EV15X12-1 SMD	0

Bobbins (Coil Formers), Mounts, Hardware

1. Overview

Bobbins (coil formers), mounts, and hardware are critical mechanical components in magnetic devices. Bobbins serve as structural supports for wound coils in transformers and inductors, while mounts/hardware ensure mechanical stability and electrical connectivity. These components enable precise winding alignment, thermal management, and electromagnetic interference (EMI) control, playing a vital role in power electronics, automotive systems, and industrial equipment.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Transformer Bobbins	Provide winding support with insulation barriers	Switch-mode power supplies (SMPS), AC/DC converters
Inductor Coil Formers	Enable precise winding geometry for inductance control	DC/DC converters, EMI filters
PCB Mounts	Secure components to printed circuit boards	Telecom equipment, automotive ECUs
Core Clamps	Mechanical fixation for ferrite/powder cores	High-frequency transformers, PFC circuits

3. Structure and Composition

Typical bobbin structures include:

Central core with winding windows
Insulation barriers (e.g., UL-certified materials)
Termination options: PCB pins, wire terminals
Thermal vias for heat dissipation

Mounts/hardware feature:

Anti-vibration rubber
Corrosion-resistant platings (nickel, zinc)
Adjustable positioning brackets

4. Key Technical Specifications

Parameter	Importance
Temperature Resistance (130-200 C)	Determines thermal stability and lifespan
Dielectric Strength (>2kV)	Ensures safety isolation between windings
Dimensional Tolerance ( 0.05mm)	Impacts winding machine compatibility
Tensile Strength (>50MPa)	Prevents mechanical deformation under load
Surface Resistivity (10^12 )	Prevents leakage current paths

5. Application Fields

Power Electronics: 5G base station PSUs, solar inverters
Automotive: On-board chargers (OBC), 48V DC/DC converters
Industrial: CNC machine power supplies, motor drives
Consumer: Fast chargers, LED drivers

6. Leading Manufacturers

Manufacturer	Representative Products
TDK-Lambda	Compact PCB-mount bobbin series for telecom
Sumec Corporation	High-temp composite coil formers
Eaton Electronics	Vibration-resistant inductor mounts
Fastron IC	Customizable toroidal core hardware kits

7. Selection Guidelines

Key considerations:

Material compatibility with expected operating temperatures
Dimensional matching to core geometries (ETD, PQ, RM types)
Vibration resistance for automotive applications
RoHS compliance for environmental regulations
Cost optimization through standard vs. customized designs

Case Study: Electric vehicle chargers use high-temperature bobbins (UL 1557 recognized) to withstand 150 C continuous operation.

8. Industry Trends

Emerging developments include:

Miniaturization through liquid crystal polymer (LCP) materials
Integrated cooling channels in bobbin designs
Smart mounts with embedded temperature sensors
Increased adoption of 3D-printed custom hardware

Market drivers: Electrification of transportation, 5G infrastructure deployment, and energy-efficient appliance standards.