PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
MAX5905ESA

MAX5905ESA

Analog Devices, Inc.

DUAL HOT-SWAP CONTROLLER

6936

LTC4223CGN-1#PBF

LTC4223CGN-1#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR ATCA 16SSOP

70

LTC4216IDE#TRPBF

LTC4216IDE#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 12DFN

0

MAX5902AAEUT

MAX5902AAEUT

Analog Devices, Inc.

HOT-SWAP CONTROLLER

4984

MAX4370ESA

MAX4370ESA

Analog Devices, Inc.

HOT-SWAP CONTROLLER

65

ADM1075-2ARUZ

ADM1075-2ARUZ

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 28TSSOP

96

LTC4231HMS-1#PBF

LTC4231HMS-1#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 12MSOP

171

MAX5946AETX+T

MAX5946AETX+T

Analog Devices, Inc.

HOT-PLUG CONTROLLER

5000

LTC4261IGN-2#TRPBF

LTC4261IGN-2#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 28SSOP

0

LTC4261IUFD#PBF

LTC4261IUFD#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 24QFN

16

LTC4215IGN#PBF

LTC4215IGN#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 16SSOP

301

LT4256-3IGN#PBF

LT4256-3IGN#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 16SSOP

3523

LT1640AHCS8#TRPBF

LT1640AHCS8#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 8SOIC

0

LTC4234HWHH#PBF

LTC4234HWHH#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 38QFN

0

LTC1421CSW#TRPBF

LTC1421CSW#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 24SOIC

0

LTC4225IGN-2#TRPBF

LTC4225IGN-2#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 24SSOP

0

ADM1070ART-REEL

ADM1070ART-REEL

Analog Devices, Inc.

-48 V HOT SWAP CONTROLLER

20000

LTC4245CG#TRPBF

LTC4245CG#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR PCI 36SSOP

0

LTC4233IWHH#PBF

LTC4233IWHH#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 38QFN

0

LT4256-1CS8#PBF

LT4256-1CS8#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 8SOIC

285

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

RFQ BOM Call Skype Email
Top