PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
LTC4227IGN-2#PBF

LTC4227IGN-2#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 16SSOP

313

LTC1643ALIGN#TRPBF

LTC1643ALIGN#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR PCI 16SSOP

0

LTC4261CUFD#TRPBF

LTC4261CUFD#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 24QFN

0

LTC4217CDHC-12#PBF

LTC4217CDHC-12#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 16DFN

105

LT1640ALIN8#PBF

LT1640ALIN8#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 8DIP

0

LTC1647-1IS8#TRPBF

LTC1647-1IS8#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 8SOIC

0

LTC1642IGN#PBF

LTC1642IGN#PBF

Analog Devices, Inc.

IC HOTSWAP CTR INFINIBAND 16SSOP

290

LTC4223CGN-2#TRPBF

LTC4223CGN-2#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR ATCA 16SSOP

0

LTC4252BCMS-1#TRPBF

LTC4252BCMS-1#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 10MSOP

0

LTC4252BCMS8-1#TRPBF

LTC4252BCMS8-1#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 8MSOP

0

LTC4211CMS#PBF

LTC4211CMS#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 10MSOP

793

LTC4252-1IMS#PBF

LTC4252-1IMS#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 10MSOP

0

MAX5929DEEG+

MAX5929DEEG+

Analog Devices, Inc.

HOT-SWAP CONTROLLER

659

LTC4238IGN#TRPBF

LTC4238IGN#TRPBF

Analog Devices, Inc.

HIGHVOLTAGE, HIGHPOWER HOTSWAP C

0

LT1640AHIS8#PBF

LT1640AHIS8#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 8SOIC

264

MAX5927ETJ

MAX5927ETJ

Analog Devices, Inc.

48V QUAD HOT-SWAP CONTROLLER

2518

LTC4223CDHD-2#PBF

LTC4223CDHD-2#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR ATCA 16DFN

0

MAX5921BESA

MAX5921BESA

Analog Devices, Inc.

HOT-SWAP CONTROLLER

0

MAX5960AECS+

MAX5960AECS+

Analog Devices, Inc.

HOT-PLUG CONTROLLER

1218

ADM1075-1ACPZ

ADM1075-1ACPZ

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 28LFCSP

97

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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