PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
MAX4273EEE

MAX4273EEE

Analog Devices, Inc.

HOT SWAP CONTROLLER

1398

LTC4226IUD-2#TRPBF

LTC4226IUD-2#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 16QFN

2350

LTC1421CSW-2.5#PBF

LTC1421CSW-2.5#PBF

Analog Devices, Inc.

HOT SWAP CONTROLLER

32

MAX5949AESA

MAX5949AESA

Analog Devices, Inc.

HOT-SWAP CONTROLLER

15504

LTC4236IUFD-2#TRPBF

LTC4236IUFD-2#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 28QFN

0

MAX5914EMH

MAX5914EMH

Analog Devices, Inc.

48V QUAD HOT-SWAP CONTROLLER

250

LTC4224IDDB-2#TRPBF

LTC4224IDDB-2#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 10DFN

0

LTC4251-2CS6#TRPBF

LTC4251-2CS6#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V SOT23-6

0

LTC4215IUFD-3#PBF

LTC4215IUFD-3#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 24QFN

0

MAX5956BEEE+

MAX5956BEEE+

Analog Devices, Inc.

POWER SUPPLY SUPPORT CIRCUIT, AD

550

LTC1645IS8#PBF

LTC1645IS8#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 8SOIC

324

LTC4252BCMS8-2#PBF

LTC4252BCMS8-2#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 8MSOP

0

LTC4210-2IS6#TRPBF

LTC4210-2IS6#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP TSOT23-6

0

LTC4211IS8#PBF

LTC4211IS8#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 8SOIC

515

LTC4252-1IMS8#PBF

LTC4252-1IMS8#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 8MSOP

0

MAX5929BEEG+

MAX5929BEEG+

Analog Devices, Inc.

HOT-SWAP CONTROLLER

878

LTC4252A-1CMS#TRPBF

LTC4252A-1CMS#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 10MSOP

0

LT1641IS8#TRPBF

LT1641IS8#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 8SOIC

0

LT4250HCS8#TRPBF

LT4250HCS8#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 8SOIC

0

MAX5905ESA+

MAX5905ESA+

Analog Devices, Inc.

MAX5905 LOW-VOLTAGE, DUAL HOT-SW

154

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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