PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
LTC4235CUFD-1#PBF

LTC4235CUFD-1#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 20QFN

66

LTC4251BIS6-2#TRMPBF

LTC4251BIS6-2#TRMPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V TSOT23-6

535

LTC4230IGN#PBF

LTC4230IGN#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 20SSOP

0

MAX5909UEE+

MAX5909UEE+

Analog Devices, Inc.

MAX5909 LOW-VOLTAGE, DUAL HOT-SW

1108

LTC4231CMS-1#TRPBF

LTC4231CMS-1#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 12MSOP

0

LTC4227IUFD-4#TRPBF

LTC4227IUFD-4#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 20QFN

0

MAX5920BESA

MAX5920BESA

Analog Devices, Inc.

HOT-SWAP CONTROLLER

779

LTC4245IG#PBF

LTC4245IG#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR PCI 36SSOP

0

LTC4231HMS-1#TRPBF

LTC4231HMS-1#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 12MSOP

0

MAX4271ESA-T

MAX4271ESA-T

Analog Devices, Inc.

HOT SWAP CONTROLLER

2002

LTC4219CDHC-12#TRPBF

LTC4219CDHC-12#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 16DFN

1288

LTC4251IS6#TRPBF

LTC4251IS6#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V SOT23-6

0

MAX5902LAEUT

MAX5902LAEUT

Analog Devices, Inc.

HOT-SWAP CONTROLLER

4293

ADM1278-1ACPZ-RL

ADM1278-1ACPZ-RL

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 32LFCSP

0

MAX5924CEUB+

MAX5924CEUB+

Analog Devices, Inc.

HOT-SWAP CONTROLLER

4962

LTC4214-2CMS#TRPBF

LTC4214-2CMS#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 10MSOP

0

MAX5946AETX+

MAX5946AETX+

Analog Devices, Inc.

MAX5946 DUAL PCI EXPRESS, HOT-PL

161

LTC4218CGN#PBF

LTC4218CGN#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR ATCA 16SSOP

795

LT4250LIS8#TRPBF

LT4250LIS8#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 8SOIC

377

MAX5920CESA

MAX5920CESA

Analog Devices, Inc.

HOT-SWAP CONTROLLER

1670

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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