PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
MAX5925BEUB+

MAX5925BEUB+

Maxim Integrated

IC HOT SWAP CTRLR GP 10UMAX

50

ISL61863ECRZ

ISL61863ECRZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 10DFN

0

MAX5927AETJ+T

MAX5927AETJ+T

Maxim Integrated

IC HOT SWAP CTRLR GP 32TQFN

0

ISL61853IIRZ-T

ISL61853IIRZ-T

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 10DFN

0

LTC4216IMS#PBF

LTC4216IMS#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 10MSOP

297

ADM1075-2ARUZ-RL7

ADM1075-2ARUZ-RL7

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 28TSSOP

935

LTC1647-2CS8#PBF

LTC1647-2CS8#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 8SOIC

0

ISL6140IBZ

ISL6140IBZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR -48V 8SOIC

0

TPS23525PWT

TPS23525PWT

Texas Instruments

IC HOT SWAP CTRLR -48V 16TSSOP

0

ISL61862FIRZ-T

ISL61862FIRZ-T

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 8DFN

0

TPS2482PWR

TPS2482PWR

Texas Instruments

IC HOT SWAP CTRLR GP 20TSSOP

0

LTC4252BIMS-1#PBF

LTC4252BIMS-1#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 10MSOP

43

UCC3915DPTR

UCC3915DPTR

UCC3915 0-3A, 7-15V SINGLE HOT-S

22446

HIP1013CB

HIP1013CB

DUAL PWR DISTRIBUTION CONTROLLER

81

ISL61862CIRZ

ISL61862CIRZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 8DFN

0

UCC2918DP/81510

UCC2918DP/81510

Texas Instruments

POWER SUPPLY SUPPORT CIRCUIT

851

TPS2390DGKR

TPS2390DGKR

Texas Instruments

TPS2390 SIMPLE -48V HOT SWAP CON

0

ADM1270ACPZ-R7

ADM1270ACPZ-R7

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 16LFCSP

615

TPS2310IPWR

TPS2310IPWR

Texas Instruments

POWER SUPPLY CIRCUIT, ADJ

32000

ISL61853JIRZ

ISL61853JIRZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 10DFN

0

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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