PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
TPS25910RSAT

TPS25910RSAT

Texas Instruments

IC HOT SWAP CTRLR GP 16QFN

1663

LTC4215CUFD#PBF

LTC4215CUFD#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 24QFN

471

ISL61862BCRZ-T

ISL61862BCRZ-T

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 8DFN

0

LTC1421IG#TRPBF

LTC1421IG#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 24SSOP

0

ISL61851DIBZ

ISL61851DIBZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 8SOIC

0

LTC4260IGN#PBF

LTC4260IGN#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 24SSOP

1727

TPS2490DGSG4

TPS2490DGSG4

Texas Instruments

IC HOT SWAP CTRLR GP 10VSSOP

0

TPS2350PW

TPS2350PW

Texas Instruments

IC HOT SWAP CTRLR -48V 14TSSOP

143

LTC4245IUHF#TRPBF

LTC4245IUHF#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR PCI 38QFN

0

UCC3921N

UCC3921N

POWER SUPPLY SUPPORT CIRCUIT, AD

3700

LTC4225IGN-2#PBF

LTC4225IGN-2#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 24SSOP

15

ISL61853BCRZ

ISL61853BCRZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 10DFN

0

TPS2320IPWRG4

TPS2320IPWRG4

Texas Instruments

IC HOT SWAP CTRLR GP 16TSSOP

0

ISL61852BCRZ

ISL61852BCRZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 8DFN

0

MAX5903LBEUT

MAX5903LBEUT

Analog Devices, Inc.

HOT-SWAP CONTROLLER

18674

LTC4252BCMS-1#PBF

LTC4252BCMS-1#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 10MSOP

0

MAX5955AEEE+T

MAX5955AEEE+T

Maxim Integrated

IC HOT SWAP CTRLR GP 16QSOP

0

LTC4228IUFD-2#PBF

LTC4228IUFD-2#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 28QFN

59

LTC4217HFE#TRPBF

LTC4217HFE#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 20TSSOP

0

LTC4252-1CMS#TRPBF

LTC4252-1CMS#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 10MSOP

0

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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