PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
TPS2393PWR

TPS2393PWR

Texas Instruments

IC HOT SWAP CTRLR -48V 14TSSOP

0

LM50672NPAR

LM50672NPAR

Texas Instruments

-9-V TO -80-V HOT SWAP CONTROLLE

999

LTC1422CS8#TRPBF

LTC1422CS8#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 8SOIC

1180

ISL61853OIRZ

ISL61853OIRZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 10DFN

0

LTC4252A-1IMS#TRPBF

LTC4252A-1IMS#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 10MSOP

0

LTC4238CUFD#TRPBF

LTC4238CUFD#TRPBF

Analog Devices, Inc.

HIGHVOLTAGE, HIGHPOWER HOTSWAP C

0

ISL61863IIRZ

ISL61863IIRZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 10DFN

0

MAX5929AHEEG+

MAX5929AHEEG+

Analog Devices, Inc.

MAX5929 LOW-VOLTAGE, QUAD, HOT-S

252

TPS2393DBT

TPS2393DBT

Texas Instruments

TPS2393 FULL FEATURED -48V HOT S

6611

LTC4223CDHD-2#TRPBF

LTC4223CDHD-2#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR ATCA 16DFN

0

LTC4251BIS6-1#TRPBF

LTC4251BIS6-1#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V TSOT23-6

0

MAX4273EEE+T

MAX4273EEE+T

Maxim Integrated

IC HOT SWAP CTRLR GP 16QSOP

0

MAX5946LETX+

MAX5946LETX+

Maxim Integrated

IC HOT SWAP CTRLR PCI EXP 36TQFN

35

LM5068MM-2/NOPB

LM5068MM-2/NOPB

Texas Instruments

IC HOT SWAP CTRLR -48V 8VSSOP

434

LTC4215CUFD-3#PBF

LTC4215CUFD-3#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 24QFN

0

MAX34561T+

MAX34561T+

Maxim Integrated

IC HOT PLUG CTRLR PCI EXP 24TQFN

0

LM5064PMHE/NOPB

LM5064PMHE/NOPB

Texas Instruments

IC HOT SWAP CTRLR -48V 28HTSSOP

271

MAX15162AATG+T

MAX15162AATG+T

Maxim Integrated

60V DUAL EFUSE FOR PA

0

TPS2392PWR

TPS2392PWR

Texas Instruments

POWER SUPPLY CIRCUIT, ADJ

12100

ISL61852EIRZ

ISL61852EIRZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 8DFN

0

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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