PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
ISL61852FIRZ

ISL61852FIRZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 8DFN

0

HIP1020CK-T

HIP1020CK-T

HOT PLUG CONTROLLER

5840

ISL61853HCRZ-T

ISL61853HCRZ-T

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 10DFN

0

TPS24742RGER

TPS24742RGER

Texas Instruments

IC HOT SWAP CTRLR GP 24VQFN

0

MP5022AGQV-P

MP5022AGQV-P

MPS (Monolithic Power Systems)

IC HOT SWAP CTRLR GP 22QFN

0

ISL61862FIRZ

ISL61862FIRZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 8DFN

0

TPS2490DGS

TPS2490DGS

Texas Instruments

TPS2490 LATCHABLE POSITIVE HIGH-

284

LTC4236IUFD-2#PBF

LTC4236IUFD-2#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 28QFN

101

ISL61851DCBZ

ISL61851DCBZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 8SOIC

0

LTC4217IFE#PBF

LTC4217IFE#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 20TSSOP

0

ADM1275-1ARQZ

ADM1275-1ARQZ

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 20QSOP

36

LTC4223CDHD-1#PBF

LTC4223CDHD-1#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR ATCA 16DFN

131

LT1641-1CS8#TRPBF

LT1641-1CS8#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 8SOIC

1758

LTC1645CS#PBF

LTC1645CS#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 14SOIC

55

TPS2399DGKG4

TPS2399DGKG4

Texas Instruments

IC HOT SWAP CTRLR -48V 8VSSOP

0

ISL61853OCRZ

ISL61853OCRZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 10DFN

0

ISL6140IBZ-T

ISL6140IBZ-T

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR -48V 8SOIC

0

ISL6150IB

ISL6150IB

Intersil (Renesas Electronics America)

POWER SUPPLY CIRCUIT, ADJ

3899

TPS24712DGSR

TPS24712DGSR

Texas Instruments

IC HOT SWAP CTRLR GP 10VSSOP

0

LTC4232IDHC#PBF

LTC4232IDHC#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 16DFN

595

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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