PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
MIC2583R-KYQS

MIC2583R-KYQS

Roving Networks / Microchip Technology

IC HOT SWAP CTRLR GP 16QSOP

0

ISL6115AIBZ-T7A

ISL6115AIBZ-T7A

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR GP 8SOIC

1125

MAX5955AEEE+

MAX5955AEEE+

Maxim Integrated

IC HOT SWAP CTRLR GP 16QSOP

1062900

ISL61853PCRZ

ISL61853PCRZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 10DFN

0

UCC39161DP

UCC39161DP

POWER SUPPLY SUPPORT CIRCUIT

17057

PI6ULS5V9511AZWEX

PI6ULS5V9511AZWEX

Zetex Semiconductors (Diodes Inc.)

IC HOT SWAP CTRLR 8UDFN

0

MAX34561T+T

MAX34561T+T

Maxim Integrated

IC HOT PLUG CTRLR PCI EXP 24TQFN

0

MP5021BGQV-Z

MP5021BGQV-Z

MPS (Monolithic Power Systems)

IC HOT SWAP CTRLR GP 22QFN

0

TPS2359RHHR

TPS2359RHHR

Texas Instruments

IC HOT SWAP CTRLR ATCA 36VQFN

620

TPS2350PWRG4

TPS2350PWRG4

Texas Instruments

IC HOT SWAP CTRLR -48V 14TSSOP

0

LTC4234IWHH#PBF

LTC4234IWHH#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 38QFN

130

ISL61863ICRZ

ISL61863ICRZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 10DFN

0

LTC4210-4IS6#TRPBF

LTC4210-4IS6#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP TSOT23-6

0

LTM9100CY#PBF

LTM9100CY#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 42BGA

99

LTC4222IUH#TRPBF

LTC4222IUH#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 32QFN

0

UCC3912PWPTR

UCC3912PWPTR

Texas Instruments

PROG HOT SWAP PWR MANAGER

8000

LTC4283CUHF#PBF

LTC4283CUHF#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 38QFN

52

LTC4225CUFD-2#TRPBF

LTC4225CUFD-2#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 24QFN

0

MAX5925CEUB+T

MAX5925CEUB+T

Maxim Integrated

IC HOT SWAP CTRLR GP 10UMAX

0

ISL61851EIBZ

ISL61851EIBZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 8SOIC

0

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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