PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
ISL6150CB

ISL6150CB

Intersil (Renesas Electronics America)

POWER SUPPLY CIRCUIT, ADJ

980

MAX5976BETE+

MAX5976BETE+

Maxim Integrated

IC HOT SWAP CTRLR GP 16TQFN

1321020

ISL61851CIBZ

ISL61851CIBZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 8SOIC

0

LTC4282CUH#TRPBF

LTC4282CUH#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 32QFN

0

LTC4225CUFD-1#PBF

LTC4225CUFD-1#PBF

ANALOG CIRCUIT, CMOS, PQCC24

730

MAX5926EEE+

MAX5926EEE+

Maxim Integrated

IC HOT SWAP CTRLR GP 16QSOP

831300

ISL61853HIRZ

ISL61853HIRZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 10DFN

0

MAX5903LAEUT

MAX5903LAEUT

Analog Devices, Inc.

HOT-SWAP CONTROLLER

3877

ES1010SI

ES1010SI

Intel

IC HOT SWAP CTRLR GP 8SOIC

699

LTC4215CUFD-1#PBF

LTC4215CUFD-1#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 24QFN

21

LTC4252-1CMS8#PBF

LTC4252-1CMS8#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 8MSOP

0

LTC4230CGN#TRPBF

LTC4230CGN#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 20SSOP

0

LTC4350IGN#PBF

LTC4350IGN#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 16SSOP

256

MIC2595-2YM

MIC2595-2YM

Roving Networks / Microchip Technology

SINGLE-CHANNEL, NEGATIVE HIGH-VO

1388

TPS2399DGKR

TPS2399DGKR

Texas Instruments

IC HOT SWAP CTRLR -48V 8VSSOP

678

TPS24751RUVR

TPS24751RUVR

Texas Instruments

IC HOT SWAP CTRLR GP 36VQFN

0

TPS2398DMT7G

TPS2398DMT7G

Sanyo Semiconductor/ON Semiconductor

IC HOT SWAP CTRLR -48V 8MSOP

15000

LM5068MMX-2/NOPB

LM5068MMX-2/NOPB

Texas Instruments

POWER SUPPLY SUPPORT CIRCUIT, FI

1339

MAX5904ESA

MAX5904ESA

Analog Devices, Inc.

DUAL HOT-SWAP CONTROLLER

0

LT1640AHIN8#PBF

LT1640AHIN8#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 8DIP

0

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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