PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
MP5022CGQV-Z

MP5022CGQV-Z

MPS (Monolithic Power Systems)

IC HOT SWAP CTRLR GP 22QFN

0

LTC1643AL-1IGN#PBF

LTC1643AL-1IGN#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR PCI 16SSOP

400

ADM1075-1ARUZ

ADM1075-1ARUZ

Analog Devices, Inc.

MINUS 48V HOT SWAP CONTROLLER AN

9406

LTC4211CMS8#TRPBF

LTC4211CMS8#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 8MSOP

0

TPS2330IPWRG4

TPS2330IPWRG4

Texas Instruments

IC HOT SWAP CTRLR GP 14TSSOP

0

UCC3912DP/81218

UCC3912DP/81218

Texas Instruments

ANALG VOLT REF & OTHER

250

ISL61862DIRZ-T

ISL61862DIRZ-T

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 8DFN

0

ISL61852BIRZ

ISL61852BIRZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 8DFN

0

MAX5913EMH

MAX5913EMH

Analog Devices, Inc.

48V QUAD HOT-SWAP CONTROLLER

0

LTC4227IGN-1#TRPBF

LTC4227IGN-1#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 16SSOP

0

LTC4224IDDB-1#TRMPBF

LTC4224IDDB-1#TRMPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 10DFN

340

MAX5900ABEUT+T

MAX5900ABEUT+T

Maxim Integrated

IC HOT SWAP CTRLR -48V SOT23-6

0

LTC4231CMS-2#PBF

LTC4231CMS-2#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 12MSOP

99

TPS2393DBTR

TPS2393DBTR

Texas Instruments

POWER SUPPLY CIRCUIT, ADJ

4000

UC3914N

UC3914N

POWER SUPPLY SUPPORT CIRCUIT

6383

LTC4227CUFD-1#PBF

LTC4227CUFD-1#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 20QFN

0

MAX5923EUP+

MAX5923EUP+

Maxim Integrated

IC HOT SWAP CTRLR GP 20TSSOP

674218

MAX5902ABEUT+T

MAX5902ABEUT+T

Maxim Integrated

IC HOT SWAP CTRLR GP SOT23-6

0

LTC4261CUFD#PBF

LTC4261CUFD#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR -48V 24QFN

0

ISL6117CBZA

ISL6117CBZA

Intersil (Renesas Electronics America)

POWER SUPPLY SUPPORT CIRCUIT, AD

1471

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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