PMIC - Hot Swap Controllers

Image Part Number Description / PDF Quantity Rfq
MAX5908EEE

MAX5908EEE

Analog Devices, Inc.

DUAL HOT-SWAP CONTROLLER

3404

MAX5910ESA+

MAX5910ESA+

Maxim Integrated

IC HOT SWAP CTR NETWORKING 8SOIC

237400

ISL61853MIRZ

ISL61853MIRZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 10DFN

0

LM5066PMHE/NOPB

LM5066PMHE/NOPB

Texas Instruments

IC HOT SWAP CTRLR GP 28HTSSOP

213

LTC4244IGN#TRPBF

LTC4244IGN#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR PCI 20SSOP

0

TPS2321IDR

TPS2321IDR

Texas Instruments

POWER SUPPLY CIRCUIT, ADJ

39795

LTC4260ISW#TRPBF

LTC4260ISW#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 24SOIC

0

ADM1275-3ACPZ

ADM1275-3ACPZ

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 20LFCSP

0

LTC1647-2CS8#TRPBF

LTC1647-2CS8#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 8SOIC

0

LTC4232IDHC-1#TRPBF

LTC4232IDHC-1#TRPBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 16DFN

0

ADM1270ARQZ-R7

ADM1270ARQZ-R7

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 16QSOP

2265

MAX5900NNETT+T

MAX5900NNETT+T

Analog Devices, Inc.

HOT-SWAP CONTROLLER

4893

LTC4261CUFD-2#PBF

LTC4261CUFD-2#PBF

Analog Devices, Inc.

NEGATIVE VOLTAGE HOT SWAP CONTRO

73

LTC4232CDHC-1#PBF

LTC4232CDHC-1#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 16DFN

0

TPS2330IPW

TPS2330IPW

Texas Instruments

IC HOT SWAP CTRLR GP 14TSSOP

15

ISL61863CCRZ

ISL61863CCRZ

Intersil (Renesas Electronics America)

IC HOT SWAP CTRLR USB 10DFN

0

LTC4229IG#PBF

LTC4229IG#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 24SSOP

107

MAX5911ESA+T

MAX5911ESA+T

Maxim Integrated

IC HOT SWAP CTRLR -48V 8SOIC

0

ADM1176-2ARMZ-R7

ADM1176-2ARMZ-R7

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 10MSOP

4790

LTC4219IDHC-5#PBF

LTC4219IDHC-5#PBF

Analog Devices, Inc.

IC HOT SWAP CTRLR GP 16DFN

186

PMIC - Hot Swap Controllers

1. Overview

Hot Swap Controllers are specialized Power Management ICs (PMICs) designed to manage the safe insertion and removal of circuit boards or modules in powered systems. They prevent electrical hazards, inrush currents, and data corruption during live plug/unplug operations. These controllers are critical in high-availability systems such as servers, data centers, and telecommunications infrastructure, enabling maintenance without system downtime.

2. Main Types and Functional Classification

Type Functional Features Application Examples
Basic Hot Swap Controllers Overcurrent/voltage protection, manual reset Entry-level servers, industrial racks
Advanced Protection Controllers Digital fault logging, adjustable current limits Telecom switches, storage arrays
Digital Hot Swap Controllers I2C/PMBus interface, real-time monitoring Cloud data centers, AI accelerators

3. Structure and Components

Typical hot swap controllers are housed in QFN, TSSOP, or BGA packages. Key components include:

  • High-side MOSFET driver for load switching
  • Current-sense amplifiers for load monitoring
  • Digital logic for fault detection and timing control
  • Thermal shutdown circuitry
  • Communication interfaces (e.g., SMBus)

4. Key Technical Specifications

Parameter Typical Range Importance
Operating Voltage 3V - 80V Determines system compatibility
Current Limit Accuracy 5% - 10% Protects against overloads
Fault Response Time 100ns - 10 s Minimizes damage during faults
Quiescent Current 10 A - 1mA Impacts power efficiency

5. Application Areas

Main industries and devices:

  • Telecommunications: 5G base stations, optical transceivers
  • Data Centers: Blade servers, RAID storage systems
  • Industrial: PLC modules, automated test equipment
  • Consumer: High-end gaming laptops, workstations
Case Study: In a cloud server, TI's TPS2491 enables hot swapping of power supplies while maintaining 12V rail stability.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments TPS2491 12V operation, 10A current limit
STMicroelectronics L6992S Embedded MOSFET driver, 45V rating
Infineon IRS2894 High-side control, 100V tolerance

7. Selection Guidelines

Key considerations:

  1. Match voltage/current ratings with system requirements
  2. Evaluate protection features (OCP, OVP, UVLO)
  3. Package size vs. thermal management needs
  4. Digital interface compatibility (if monitoring required)
  5. Cost vs. reliability trade-offs for specific applications

8. Industry Trends

Future directions:

  • Integration with digital power management ecosystems
  • Adoption of GaN/SiC transistors for higher efficiency
  • AI-driven predictive fault detection
  • Miniaturization for dense PCB layouts
  • Standardization of hot-swap protocols across industries

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