Memory - Configuration Proms for FPGAs

Part Number	Description / PDF	Quantity
XC18V512SO20C Xilinx	IC PROM SRL CONFIG 512K 20-SOIC	0
XC18V512PCG20C Xilinx	IC PROM REPROGR 512KB 20-PLCC	0
XC1765ELPC20C Xilinx	CONFIG MEMORY, 64KX1, SERIAL	4341
XC18V04VQG44C Xilinx	IC PROM REPROGR 4MB 44-VQFP	0
XC1704LPC44I Xilinx	CONFIG MEMORY, 4MX1, SERIAL	376
XCF04SVO20C Xilinx	IC PROM IN SYST PRG 3.3V 20TSSOP	519
XC18V01PCG20C Xilinx	IC PROM SERIAL CONFIG 1M 20-PLCC	0
XC1765ELSOG8C Xilinx	CONFIG MEMORY, 64KX1, SERIAL	6510
XC18V02VQG44C Xilinx	IC PROM REPROGR 2MB 44-VQFP	0
XC1701LPC20I Xilinx	CONFIG MEMORY, 1MX1, SERIAL	0
XC1702LPC44C Xilinx	CONFIG MEMORY, 2MX1, SERIAL	95
XC17128EPCG20C Xilinx	CONFIG MEMORY, 128KX1, SERIAL	22
XC17S200AVQ44C Xilinx	CONFIG MEMORY, SERIAL	2138
XC17256EPC20C Xilinx	CONFIG MEMORY, 256KX1, SERIAL	1685
XC1765ELVOG8C Xilinx	CONFIG MEMORY, 64KX1, SERIAL	6809
XC17V02PC20C Xilinx	CONFIG MEMORY, 2MX1, SERIAL	243
XCF32PVO48C Xilinx	CONFIG MEMORY, 32MX1, SERIAL	17604
XCF32PFSG48C Xilinx	IC PROM SRL/PAR 1.8V 32M 48CSBGA	0
XCF04SVOG20C Xilinx	IC PROM SRL FOR 4M GATE 20-TSSOP	0
XC17S200AVQ44I Xilinx	CONFIG MEMORY, SERIAL	3467

Memory - Configuration Proms for FPGAs

1. Overview

Configuration PROMs (Programmable Read-Only Memory) for FPGAs are non-volatile memory devices designed to store configuration data for Field-Programmable Gate Arrays (FPGAs). These devices enable FPGAs to retain their programmed logic functionality after power cycling. Modern applications demand reliable, high-speed, and secure storage solutions for FPGA configurations in aerospace, telecommunications, automotive, and industrial systems.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
OTP PROMs	One-Time Programmable, low cost, high reliability	Industrial control systems
Flash PROMs	Reprogrammable, high density, moderate endurance	5G base stations
EEPROM	Byte-alterable, high endurance, slower access speed	Medical imaging equipment
FRAM	Low-power, radiation-hardened, fast write speed	Aerospace avionics

3. Structure and Composition

Typical configuration PROMs feature:

Package types: TSSOP, VQFN, BGA
Memory array: Floating-gate or antifuse-based technology
Interface: SPI, BPI, or parallel bus
Voltage rails: 1.2V-3.3V operation with decoupling capacitors
Error correction: Built-in ECC for radiation environments

4. Key Technical Specifications

Parameter	Significance
Memory density (1Mb-4Gb)	Determines maximum FPGA configuration size
Access time (55ns-120ns)	Impacts system boot speed
Endurance (10k-100k cycles)	Dictates reprogramming lifespan
Data retention (20-100 years)	Critical for long-term reliability
Radiation hardness (SEL/SEU immunity)	Essential for space applications

5. Application Areas

Primary application domains:

Telecommunications: 5G NR base stations, optical transceivers
Industrial: Programmable logic controllers (PLCs)
Medical: MRI scanners, patient monitoring systems
Automotive: ADAS sensor fusion units
Defense: Radar signal processing systems

6. Key Manufacturers and Products

Manufacturer	Product Series	Key Features
Microchip	AT17F Series	128Mb SPI interface, -40 C to +125 C
Intel	EP180S	Secure boot, TSMC 16nm process
Xilinx	S25FL-V	Octal SPI, 400MHz clock rate
Cypress	FL-S Series	End-to-end data protection

7. Selection Guidelines

Key selection factors:

Match memory density to target FPGA's bitstream size
Verify interface compatibility (SPI/BPI/parallel)
Evaluate environmental requirements (temperature, radiation)
Assess security features (encryption, authentication)
Consider programming infrastructure (socket compatibility)

8. Industry Trends

Current development trends include:

Transition to 3D NAND architecture for densities beyond 8Gb
Integration of hardware security modules (HSM)
Adoption of JEDEC Xccela interface for >400MB/s throughput
Development of radiation-tolerant devices for LEO satellites
Implementation of AI-driven wear-leveling algorithms