Memory - Configuration Proms for FPGAs

Image	Part Number	Description / PDF	Quantity	Rfq
	XC17S30XLVOG8C Xilinx	IC PROM SERIAL 3.3V 300K 8-SOIC	0
	XC17S50ASO20I Xilinx	IC PROM SER 50000 I-TEMP 20-SOIC	0
	XC17S15ASO20I Xilinx	IC PROM SER 5000 I-TEMP 20-SOIC	0
	XC17128EPDG8C Xilinx	IC PROM SERIAL 128K 8-DIP	0
	XC17S200APD8C Xilinx	IC PROM SER 200000 C-TEMP 8-DIP	0
	XC17S30XLPD8C Xilinx	IC PROM PROG C-TEMP 3.3V 8-DIP	0
	XC17S200APD8I Xilinx	IC PROM SER 200000 I-TEMP 8-DIP	0
	XC17S10PD8I Xilinx	IC PROM PROG I-TEMP 3.3V 8-DIP	0
	XC17V02PC44I Xilinx	IC PROM SER 2MBIT 3.3V 44-PLCC	0
	XC17S10VOG8C Xilinx	IC PROM SERIAL 10K 8-SOIC	0
	XC17S20XLPD8I Xilinx	IC PROM PROG I-TEMP 3.3V 8-DIP	0
	XC17S20VO8C Xilinx	IC PROM SER 200K 8-SOIC	0
	XC17S10PD8C Xilinx	IC PROM PROG C-TEMP 3.3V 8-DIP	0
	XC17S10XLVO8C Xilinx	IC 3V PROM SER 10K 8-SOIC	0
	XC17S150AVO8I Xilinx	IC PROM SER 150K 8-SOIC	0
	XC17S40XLPD8C Xilinx	IC PROM PROG C-TEMP 3.3V 8-DIP	0
	XC17V16PC44C Xilinx	IC PROM SER C-TEMP 3.3V 44-PLCC	0
	XC17S30PD8C Xilinx	IC PROM PROG C-TEMP 5V 8-DIP	0
	XC18V512PC20I Xilinx	IC PROM SER I-TEMP 3.3V 20-PLCC	0
	XC1701LPCG20C Xilinx	IC PROM SERIAL 1K 20-PLCC	0

Memory - Configuration Proms for FPGAs

1. Overview

Configuration PROMs (Programmable Read-Only Memory) for FPGAs are non-volatile memory devices designed to store configuration data for Field-Programmable Gate Arrays (FPGAs). These devices enable FPGAs to retain their programmed logic functionality after power cycling. Modern applications demand reliable, high-speed, and secure storage solutions for FPGA configurations in aerospace, telecommunications, automotive, and industrial systems.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
OTP PROMs	One-Time Programmable, low cost, high reliability	Industrial control systems
Flash PROMs	Reprogrammable, high density, moderate endurance	5G base stations
EEPROM	Byte-alterable, high endurance, slower access speed	Medical imaging equipment
FRAM	Low-power, radiation-hardened, fast write speed	Aerospace avionics

3. Structure and Composition

Typical configuration PROMs feature:

Package types: TSSOP, VQFN, BGA
Memory array: Floating-gate or antifuse-based technology
Interface: SPI, BPI, or parallel bus
Voltage rails: 1.2V-3.3V operation with decoupling capacitors
Error correction: Built-in ECC for radiation environments

4. Key Technical Specifications

Parameter	Significance
Memory density (1Mb-4Gb)	Determines maximum FPGA configuration size
Access time (55ns-120ns)	Impacts system boot speed
Endurance (10k-100k cycles)	Dictates reprogramming lifespan
Data retention (20-100 years)	Critical for long-term reliability
Radiation hardness (SEL/SEU immunity)	Essential for space applications

5. Application Areas

Primary application domains:

Telecommunications: 5G NR base stations, optical transceivers
Industrial: Programmable logic controllers (PLCs)
Medical: MRI scanners, patient monitoring systems
Automotive: ADAS sensor fusion units
Defense: Radar signal processing systems

6. Key Manufacturers and Products

Manufacturer	Product Series	Key Features
Microchip	AT17F Series	128Mb SPI interface, -40 C to +125 C
Intel	EP180S	Secure boot, TSMC 16nm process
Xilinx	S25FL-V	Octal SPI, 400MHz clock rate
Cypress	FL-S Series	End-to-end data protection

7. Selection Guidelines

Key selection factors:

Match memory density to target FPGA's bitstream size
Verify interface compatibility (SPI/BPI/parallel)
Evaluate environmental requirements (temperature, radiation)
Assess security features (encryption, authentication)
Consider programming infrastructure (socket compatibility)

8. Industry Trends

Current development trends include:

Transition to 3D NAND architecture for densities beyond 8Gb
Integration of hardware security modules (HSM)
Adoption of JEDEC Xccela interface for >400MB/s throughput
Development of radiation-tolerant devices for LEO satellites
Implementation of AI-driven wear-leveling algorithms