Memory - Configuration Proms for FPGAs

Part Number	Description / PDF	Quantity
XC17S150XLPD8C Xilinx	CONFIG MEMORY, 1M BITS, SERIAL	555
XC17S40XLSO20I Xilinx	CONFIGS MEMORY, 330696 BITS	117
XC18V04PCG44C Xilinx	IC PROM REPROGR 4MB 44-PLCC	0
XC17S100XLPD8I Xilinx	CONFIG MEMORY, 781,216 BITS	0
XCF08PVOG48C Xilinx	IC PROM SRL 1.8V 8M GATE 48TSOP	688
XC17512LSO20C Xilinx	CONFIG MEMORY, 512KX1, SERIAL	636
XC1765ELSO8C Xilinx	CONFIG MEMORY, 64KX1, SERIAL	6995
XC18V02VQ44C Xilinx	IC PROM SRL FOR 2M GATE 44-VQFP	0
XCF16PVO48C0973 Xilinx	CONFIG MEMORY, 16MX1, SERIAL	54055
XCF02SVO20C Xilinx	IC PROM IN SYST PRG 3.3V 20TSSOP	877
XC1736EPC20C Xilinx	CONFIG MEMORY, 36288X1, SERIAL	1135
XC18V01PC20C Xilinx	IC PROM SERIAL CONFIG 1M 20-PLCC	0
XC18V512VQG44C Xilinx	IC PROM REPROGR 512KB 44-VQFP	0
XC1702LVQ44C Xilinx	CONFIG MEMORY, 2MX1, SERIAL	33
XCF128XFT64C Xilinx	IC PROM SRL 128M GATE 64-FTBGA	0
XC1704LVQ44C Xilinx	CONFIG MEMORY, 4MX1, SERIAL	0
XCF32PFS48C Xilinx	IC PROM SRL/PAR 1.8V 32M 48CSBGA	0
XCF16PFS48C Xilinx	IC PROM SRL 1.8V 16M 48CSBGA	0
XCF08PFS48C Xilinx	IC PROM SRL 1.8V 8M GATE 48CSBGA	0
XCF16PVO48C Xilinx	CONFIG MEMORY, 16MX1, SERIAL	0

Memory - Configuration Proms for FPGAs

1. Overview

Configuration PROMs (Programmable Read-Only Memory) for FPGAs are non-volatile memory devices designed to store configuration data for Field-Programmable Gate Arrays (FPGAs). These devices enable FPGAs to retain their programmed logic functionality after power cycling. Modern applications demand reliable, high-speed, and secure storage solutions for FPGA configurations in aerospace, telecommunications, automotive, and industrial systems.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
OTP PROMs	One-Time Programmable, low cost, high reliability	Industrial control systems
Flash PROMs	Reprogrammable, high density, moderate endurance	5G base stations
EEPROM	Byte-alterable, high endurance, slower access speed	Medical imaging equipment
FRAM	Low-power, radiation-hardened, fast write speed	Aerospace avionics

3. Structure and Composition

Typical configuration PROMs feature:

Package types: TSSOP, VQFN, BGA
Memory array: Floating-gate or antifuse-based technology
Interface: SPI, BPI, or parallel bus
Voltage rails: 1.2V-3.3V operation with decoupling capacitors
Error correction: Built-in ECC for radiation environments

4. Key Technical Specifications

Parameter	Significance
Memory density (1Mb-4Gb)	Determines maximum FPGA configuration size
Access time (55ns-120ns)	Impacts system boot speed
Endurance (10k-100k cycles)	Dictates reprogramming lifespan
Data retention (20-100 years)	Critical for long-term reliability
Radiation hardness (SEL/SEU immunity)	Essential for space applications

5. Application Areas

Primary application domains:

Telecommunications: 5G NR base stations, optical transceivers
Industrial: Programmable logic controllers (PLCs)
Medical: MRI scanners, patient monitoring systems
Automotive: ADAS sensor fusion units
Defense: Radar signal processing systems

6. Key Manufacturers and Products

Manufacturer	Product Series	Key Features
Microchip	AT17F Series	128Mb SPI interface, -40 C to +125 C
Intel	EP180S	Secure boot, TSMC 16nm process
Xilinx	S25FL-V	Octal SPI, 400MHz clock rate
Cypress	FL-S Series	End-to-end data protection

7. Selection Guidelines

Key selection factors:

Match memory density to target FPGA's bitstream size
Verify interface compatibility (SPI/BPI/parallel)
Evaluate environmental requirements (temperature, radiation)
Assess security features (encryption, authentication)
Consider programming infrastructure (socket compatibility)

8. Industry Trends

Current development trends include:

Transition to 3D NAND architecture for densities beyond 8Gb
Integration of hardware security modules (HSM)
Adoption of JEDEC Xccela interface for >400MB/s throughput
Development of radiation-tolerant devices for LEO satellites
Implementation of AI-driven wear-leveling algorithms