Memory - Configuration Proms for FPGAs

Part Number	Description / PDF	Quantity
XCF08PVO48C Xilinx	CONFIG MEMORY, 8MX1, SERIAL	25973
XCF08PVO48C. Xilinx	CONFIG MEMORY, 8MX1, SERIAL	305
XC17128ELVO8C Xilinx	CONFIG MEMORY, 128KX1, SERIAL	51
XC17V02PC20I Xilinx	CONFIG MEMORY, 2MX1, SERIAL	313
XC18V512PC20C Xilinx	IC PROM SRL CONFIG 512K 20-PLCC	0
XC1701PC20C Xilinx	CONFIG MEMORY, 1MX1, SERIAL	41
XC18V04PC44C Xilinx	IC PROM SER C-TEMP 3.3V 44-PLCC	0
XCF08PFSG48C Xilinx	IC PROM SRL 1.8V 8M GATE 48CSBGA	4
XC17256EPC20I Xilinx	CONFIG MEMORY, 256KX1, SERIAL	1958
XC1765EVO8C Xilinx	CONFIG MEMORY, 64KX1, SERIAL	575
XC1765ESOG8C Xilinx	CONFIG MEMORY, 64KX1, SERIAL	1035
XC18V512SOG20C Xilinx	IC PROM REPROGR 512KB 20-SOIC	0
XCF16PFSG48C Xilinx	IC PROM SRL 1.8V 16M 48CSBGA	20
XCF08PVO48C0973 Xilinx	CONFIG MEMORY, 8MX1, SERIAL	10395
XC17256ELPC20C Xilinx	CONFIG MEMORY, 256KX1, SERIAL	2131
XC17S150XLSO20C Xilinx	CONFIG MEMORY, 1M BITS, SERIAL	550
XC18V04VQ44C Xilinx	IC PROM SRL FOR 4M GATE 44-VQFP	169
XC1765EVO8I Xilinx	CONFIG MEMORY, 64KX1, SERIAL	3986
XC17V01SO20I Xilinx	CONFIG MEMORY, 1MX1, SERIAL	3464
XC17256ELVO8C Xilinx	CONFIG MEMORY, 256KX1, SERIAL	1464

Memory - Configuration Proms for FPGAs

1. Overview

Configuration PROMs (Programmable Read-Only Memory) for FPGAs are non-volatile memory devices designed to store configuration data for Field-Programmable Gate Arrays (FPGAs). These devices enable FPGAs to retain their programmed logic functionality after power cycling. Modern applications demand reliable, high-speed, and secure storage solutions for FPGA configurations in aerospace, telecommunications, automotive, and industrial systems.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
OTP PROMs	One-Time Programmable, low cost, high reliability	Industrial control systems
Flash PROMs	Reprogrammable, high density, moderate endurance	5G base stations
EEPROM	Byte-alterable, high endurance, slower access speed	Medical imaging equipment
FRAM	Low-power, radiation-hardened, fast write speed	Aerospace avionics

3. Structure and Composition

Typical configuration PROMs feature:

Package types: TSSOP, VQFN, BGA
Memory array: Floating-gate or antifuse-based technology
Interface: SPI, BPI, or parallel bus
Voltage rails: 1.2V-3.3V operation with decoupling capacitors
Error correction: Built-in ECC for radiation environments

4. Key Technical Specifications

Parameter	Significance
Memory density (1Mb-4Gb)	Determines maximum FPGA configuration size
Access time (55ns-120ns)	Impacts system boot speed
Endurance (10k-100k cycles)	Dictates reprogramming lifespan
Data retention (20-100 years)	Critical for long-term reliability
Radiation hardness (SEL/SEU immunity)	Essential for space applications

5. Application Areas

Primary application domains:

Telecommunications: 5G NR base stations, optical transceivers
Industrial: Programmable logic controllers (PLCs)
Medical: MRI scanners, patient monitoring systems
Automotive: ADAS sensor fusion units
Defense: Radar signal processing systems

6. Key Manufacturers and Products

Manufacturer	Product Series	Key Features
Microchip	AT17F Series	128Mb SPI interface, -40 C to +125 C
Intel	EP180S	Secure boot, TSMC 16nm process
Xilinx	S25FL-V	Octal SPI, 400MHz clock rate
Cypress	FL-S Series	End-to-end data protection

7. Selection Guidelines

Key selection factors:

Match memory density to target FPGA's bitstream size
Verify interface compatibility (SPI/BPI/parallel)
Evaluate environmental requirements (temperature, radiation)
Assess security features (encryption, authentication)
Consider programming infrastructure (socket compatibility)

8. Industry Trends

Current development trends include:

Transition to 3D NAND architecture for densities beyond 8Gb
Integration of hardware security modules (HSM)
Adoption of JEDEC Xccela interface for >400MB/s throughput
Development of radiation-tolerant devices for LEO satellites
Implementation of AI-driven wear-leveling algorithms