Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
SN74ABT620N Texas Instruments	IC TRANSCEIVER INVERT 5.5V 20DIP	32210
SN64BCT25244DW Texas Instruments	IC BUF NON-INVERT 5.5V 24SOIC	6210000
SN74LVC1G17QDRYRQ1 Texas Instruments	IC BUFFER NON-INVERT 5.5V 6SON	2548
74LVCH16245ADLRG4 Texas Instruments	IC TXRX NON-INVERT 3.6V 48SSOP	0
SN74AC564DBLE Texas Instruments	BUS DRIVER, AC SERIES, 8-BIT	3000
SN74ABT534APWLE Texas Instruments	BUS DRIVER, ABT SERIES, 8-BIT	10000
SN74LVTH240NSR Texas Instruments	IC BUFFER INVERT 3.6V 20SO	1961
SN74LVT244BNSR Texas Instruments	IC BUFFER NON-INVERT 3.6V 20SO	2004
CY74FCT827CTQCTG4 Texas Instruments	IC BUF NON-INVERT 5.25V 24SSOP	0
SN74HC240DWR Texas Instruments	IC BUFFER INVERT 6V 20SOIC	1751
SN74HC245APW Texas Instruments	IC TXRX NON-INVERT 6V 20TSSOP	3080
SNJ54F373FK Texas Instruments	54F373 - OCTAL TRANSPARENT LATCH	37
SN74BCT29828BDW Texas Instruments	BUS DRIVER, BCT/FBT SERIES	950
SN74AUP3G17DCUR Texas Instruments	IC BUFFER NON-INVERT 3.6V 8VSSOP	2781
SN74ALVTH162827GR Texas Instruments	IC BUF NON-INVERT 3.6V 56TSSOP	1915
SN74BCT245DBR Texas Instruments	IC TXRX NON-INVERT 5.5V 20SSOP	69732
SN74HCT541N Texas Instruments	IC BUF NON-INVERT 5.5V 20DIP	247010000
SN74ABT541BDBR Texas Instruments	IC BUF NON-INVERT 5.5V 20SSOP	2591
SN74LVTH126NS Texas Instruments	IC BUFFER NON-INVERT 3.6V 14SOP	25850
SN74LVTH244AQDBREP Texas Instruments	IC BUF NON-INVERT 3.6V 20SSOP	1511

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications