Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
SN74LVC2244APWG4 Texas Instruments	IC BUF NON-INVERT 3.6V 20TSSOP	0
SN74LS644DW Texas Instruments	BUS TRANSCEIVER, LS SERIES TTL	1154
74ACT11240NT Texas Instruments	IC BUFFER INVERT 5.5V 24DIP	9991
SN74HCT245NS Texas Instruments	IC TXRX NON-INVERT 5.5V 20SO	1015
SN74HC126DG4 Texas Instruments	IC BUFFER NON-INVERT 6V 14SOIC	0
SNJ54AS240FK Texas Instruments	BUS DRIVER, AS SERIES	54
74LVTH162245ZRDR Texas Instruments	IC TXRX NON-INVERT 3.6V 54BGA	1879
SN74HC125PWRG4 Texas Instruments	IC BUFFER NON-INVERT 6V 14TSSOP	0
SN74ACT245NG4 Texas Instruments	IC TXRX NON-INVERT 5.5V 20DIP	0
SN74ALS640BNSR Texas Instruments	IC TRANSCEIVER INVERT 5.5V 20SO	4000
CY74FCT244ATPC Texas Instruments	IC BUF NON-INVERT 5.25V 20DIP	718
SN74LV244ATPW Texas Instruments	IC BUF NON-INVERT 5.5V 20TSSOP	1786
CY74FCT162244CTPAC Texas Instruments	BUS DRIVER, 4-BIT,	1578
SN74LVCHR16245AVR Texas Instruments	IC TXRX NON-INVERT 3.6V 48TVSOP	0
SN74ABT541DWR Texas Instruments	BUS DRIVER, ABT SERIES, 8-BIT	0
SN74LVCH8T245PW Texas Instruments	IC TRANSLATION TXRX 5.5V 24TSSOP	316
CD74HC4050PWR Texas Instruments	IC BUFFER NON-INVERT 6V 16TSSOP	15195
SN74ABT646ANS Texas Instruments	IC BUS TXRX DUAL 3-ST 24SO	5882
CD74ACT541E Texas Instruments	IC BUFFER NON-INVERT 5.5V 20DIP	14081
SN74LVC821DW Texas Instruments	BUS DRIVER, LVC/LCX/Z SERIES, 1	10690

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications