Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
74AC11240NT Texas Instruments	IC BUFFER INVERT 5.5V 24DIP	2247
SN74LS640DB Texas Instruments	IC BUS TRANSCEIVER 8BIT 20SO	3570
SN74HCT244PWT Texas Instruments	IC BUF NON-INVERT 5.5V 20TSSOP	1250
CD74ACT652M96 Texas Instruments	IC TXRX NON-INVERT 5.5V 24SOIC	1663
SN74ABT646APW Texas Instruments	IC TXRX NON-INVERT 5.5V 24TSSOP	425
SN74LV540ADWR Texas Instruments	IC BUFFER INVERT 5.5V 20SOIC	9763
74ALVCHS162830AGR Texas Instruments	IC ADDRESS DRIVER 3.6V 80TSSOP	50000
SN74ABT623N Texas Instruments	IC TXRX NON-INVERT 5.5V 20DIP	37055
SN74LV541ATPWT Texas Instruments	IC BUF NON-INVERT 5.5V 20TSSOP	750
SN74LVTH244ADW Texas Instruments	IC BUF NON-INVERT 3.6V 20SOIC	79
SN74LV540ADGVR Texas Instruments	IC BUFFER INVERT 5.5V 20TVSOP	4422
SN74LVT162245DGGR Texas Instruments	IC TXRX NON-INVERT 3.6V 48TSSOP	18789
74AVCH4T245RGYRG4 Texas Instruments	IC TRANSLATION TXRX 3.6V 16VQFN	2000
CD74HC366M96 Texas Instruments	IC BUFFER INVERT 6V 16SOIC	1014
SN74AHC540DWE4 Texas Instruments	IC BUFFER INVERT 5.5V 20SOIC	0
SN74ABT640DW Texas Instruments	IC TXRX INVERT 5.5V 20SOIC	360
CD74FCT543M Texas Instruments	BUS TRANSCEIVER, FCT SERIES	300
SN74ALVCH16646DGG Texas Instruments	REGISTERED BUS TRANSCEIVER, ALVC	595
SN74AUC244RGYR Texas Instruments	IC BUFFER NON-INVERT 2.7V 20VQFN	1959
SN74ALVTH162244GR Texas Instruments	IC BUF NON-INVERT 3.6V 48TSSOP	988

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications