Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
SN74AHC244N Texas Instruments	IC BUF NON-INVERT 5.5V 20DIP	1915
SN74AHCT367NSR Texas Instruments	IC BUFFER NON-INVERT 5.5V 16SO	8000
SN74ABT534N Texas Instruments	BUS DRIVER, ABT SERIES, 8-BIT	0
7705701RA Texas Instruments	SN54LS244 OCTAL BUFFERS AND LINE	498
SN74LVC828APWR Texas Instruments	IC BUFFER INVERT 3.6V 24TSSOP	1925
SN74LVCZ240ANSR Texas Instruments	IC BUFFER INVERT 3.6V 20SO	30000
CD74ACT541M Texas Instruments	IC BUF NON-INVERT 5.5V 20SOIC	385
SN74LVC244ADWRE4 Texas Instruments	IC BUF NON-INVERT 3.6V 20SOIC	0
SNJ54AS241J Texas Instruments	BUS DRIVER, AS SERIES	4685
SN74AHC244NS Texas Instruments	IC BUFFER NON-INVERT 5.5V 20SO	2257
84074012A Texas Instruments	SN54HC240 OCTAL BUFFERS AND LINE	10
SN74LV1T125DBVRG4 Texas Instruments	IC BUF NON-INVERT 5.5V SOT23-5	0
SN74LVC1G07DSF2 Texas Instruments	IC BUFFER NON-INVERT 5.5V 6SON	4150
SN74AHCT244DWE4 Texas Instruments	IC BUFFER NON-INVERT 5.5V 20SOIC	0
SN74AS240ADWR Texas Instruments	IC BUFFER INVERT 5.5V 20SOIC	64
SN74ALS2541N Texas Instruments	IC BUFFER NON-INVERT 5.5V 20DIP	9730
SN74LVTH162240DGGR Texas Instruments	IC BUFFER INVERT 3.6V 48TSSOP	24000
74FCT162245CTPVCG4 Texas Instruments	IC TXRX NON-INVERT 5.5V 48SSOP	0
CLVC244AQDWRG4Q1 Texas Instruments	IC BUF NON-INVERT 3.6V 20SOIC	1795
JM38510/32503B2A Texas Instruments	54LS374 OCTAL D-TYPE EDGE TRIGGE	35

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications