Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
SN74AHCT245N Texas Instruments	IC TXRX NON-INVERT 5.5V 20DIP	1454
SN74AHCT540N Texas Instruments	IC BUFFER INVERT 5.5V 20DIP	35151
SN74HCT245DWR Texas Instruments	IC TXRX NON-INVERT 5.5V 20SOIC	7036
74FCT162244CTPVCT Texas Instruments	IC BUF NON-INVERT 5.5V 48SSOP	974
SNJ54ABT240W Texas Instruments	54ABT240 OCTAL BUFFERS/DRIVERS W	138
SN74ABT16540ADGGR Texas Instruments	SN74ABT16540A 16-BIT BUFFERS/DRI	2000
CD74HC243M96 Texas Instruments	IC TXRX NON-INVERT 6V 14SOIC	1006
CD74FCT573E Texas Instruments	BUS DRIVER, FCT SERIES	2880
SN74AVCH4T245RGYR Texas Instruments	IC TRANSLATION TXRX 3.6V 16VQFN	8238
SN74LVTH125DGVR Texas Instruments	IC BUF NON-INVERT 3.6V 14TVSOP	6015
SN74ALB16245DL Texas Instruments	IC TXRX NON-INVERT 3.6V 48SSOP	10248
SN74HC125DT Texas Instruments	IC BUFFER NON-INVERT 6V 14SOIC	1150
CY74FCT240TSOC Texas Instruments	IC BUFFER INVERT 5.25V 20SOIC	1100
CY74FCT163244APAC Texas Instruments	BUS DRIVER, FCT SERIES	396
SN74F241DW Texas Instruments	IC BUF NON-INVERT 5.5V 20SOIC	350
SN74ACT244DWR Texas Instruments	IC BUF NON-INVERT 5.5V 20SOIC	4049
CY74FCT162244ATPVC Texas Instruments	IC BUF NON-INVERT 5.5V 48SSOP	284
SN74ABT620DWR Texas Instruments	IC TXRX INVERT 5.5V 20SOIC	6000
SN74LVT125PWG4 Texas Instruments	IC BUF NON-INVERT 3.6V 14TSSOP	0
SN74AS640DW Texas Instruments	IC TXRX INVERT 5.5V 20SOIC	1183

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications