Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
SN74HCT652DWR Texas Instruments	IC TXRX NON-INVERT 5.5V 24SOIC	1637
SN74LV540ANSRE4 Texas Instruments	IC BUFFER INVERT 5.5V 20SO	0
SN74ALS35AD Texas Instruments	IC BUF NON-INVERT 5.5V 14SOIC	11
SN74F240DW Texas Instruments	IC BUFFER INVERT 5.5V 20SOIC	628
SN74LVTH2952DW Texas Instruments	IC TXRX NON-INVERT 3.6V 24SOIC	28009
SN74LVC1G06YZVR Texas Instruments	IC BUFFER INVERT 5.5V 4DSBGA	4629
SN74LV541ADB Texas Instruments	IC BUFF/DVR TRI-ST 8BIT 20SSOP	4200
SN74ABTH16244DL Texas Instruments	IC BUF NON-INVERT 5.5V 48SSOP	425
SN74ALS540NSR Texas Instruments	IC BUFFER INVERT 5.5V 20SO	0
74ACT16543DGGR Texas Instruments	IC TXRX NON-INVERT 5.5V 56TSSOP	10267
SN74AC241DWR Texas Instruments	IC BUFFER NON-INVERT 6V 20SOIC	1816
SN74AS756DW Texas Instruments	IC BUFFER INVERT 5.5V 20SOIC	76
SN74LS245NS Texas Instruments	IC TXRX NON-INVERT 5.25V 20SO	1019
SNJ54HC125FK Texas Instruments	54HC125 QUADRUPLE BUS BUFFER GAT	4
74AHCT1G126DBVRE4 Texas Instruments	IC BUF NON-INVERT 5.5V SOT23-5	0
SN74AC563PWLE Texas Instruments	BUS DRIVER, AC SERIES, 8-BIT	1000
SN74LVT162240DLG4 Texas Instruments	IC BUFFER INVERT 3.6V 48SSOP	0
SN74LVTH16245AZRDR Texas Instruments	IC TXRX NON-INVERT 3.6V 54BGA	1035
SN74LVC244PWR Texas Instruments	BUS DRIVER, LVC/LCX/Z SERIES, 2	49290
SN74LV367ADGVR Texas Instruments	IC BUF NON-INVERT 5.5V 16TVSOP	11750

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications