Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
SN74HC367PWT Texas Instruments	IC BUFFER NON-INVERT 6V 16TSSOP	1000
SN74AUC2G126DCTR Texas Instruments	IC BUFFER NON-INVERT 2.7V SM8	99000
SN74ALVCH245PW Texas Instruments	IC TXRX NON-INVERT 3.6V 20TSSOP	1070
CD74AC541SM Texas Instruments	BUS DRIVER, AC SERIES, 8-BIT,	0
SN74LV126ADBR Texas Instruments	IC BUF NON-INVERT 5.5V 14SSOP	1665
SN74LVCH32245AGKER Texas Instruments	BUS TRANSCEIVER, LVC/LCX/Z SERIE	8231
SN74LVC821DBR Texas Instruments	BUS DRIVER, LVC/LCX/Z SERIES	8000
SN74BCT125AN Texas Instruments	IC BUFFER NON-INVERT 5.5V 14DIP	27050
74AHC1G126MDCKTEP Texas Instruments	IC BUF NON-INVERT 5.5V SC70-5	370
SN74ABT245BN Texas Instruments	IC TXRX NON-INVERT 5.5V 20DIP	1385
SN74LVTH162240DL Texas Instruments	IC BUFFER INVERT 3.6V 48SSOP	21529
SN74ALS638A-1N Texas Instruments	BUS TRANSCEIVER, ALS SERIES, 1-F	4779
SN74BCT2827CDW Texas Instruments	IC BUFFER NON-INVERT 5.5V 24SOIC	0
CY74FCT646ATSOCT Texas Instruments	IC TXRX NON-INVERT 5.25V 24SOIC	25000
SN64BCT25244DWR Texas Instruments	IC BUFFER NON-INVERT 5.5V 24SOIC	2000
SN74ALS241C-1N Texas Instruments	BUS DRIVER, ALS SERIES	4701
5962-9678001QXA Texas Instruments	SN54LVTH162245 3.3-V ABT 16-BIT	2
CY74FCT2543CTQCT Texas Instruments	IC TXRX NON-INVERT 5.25V 24SSOP	2500
SN74AHCT540DW Texas Instruments	IC BUFFER INVERT 5.5V 20SOIC	1073
CY74FCT541ATQCT Texas Instruments	IC BUF NON-INVERT 5.25V 20SSOP	793

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications