Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
SN74ABTH25245DW Texas Instruments	IC TXRX NON-INVERT 5.5V 24SOIC	36
SN74AHCT541PWRG4 Texas Instruments	IC BUF NON-INVERT 5.5V 20TSSOP	775
SN74HC241DWRG4 Texas Instruments	IC BUFFER NON-INVERT 6V 20SOIC	0
SN74LVC16543DLR Texas Instruments	REGISTERED BUS TRANSCEIVER	9439
SN74LVC861ADWR Texas Instruments	IC TXRX NON-INVERT 3.6V 24SOIC	4000
5962-9322701QRA Texas Instruments	SN54ABT241 OCTAL BUFFERS/DRIVERS	48
SN74LVT125QDRG4Q1 Texas Instruments	IC BUF NON-INVERT 3.6V 14SOIC	0
SN74ALS880ADW Texas Instruments	BUS DRIVER, ALS SERIES	455
SN74AUC16245DGGR Texas Instruments	IC TXRX NON-INVERT 2.7V 48TSSOP	13841
CY74FCT163501CPVC Texas Instruments	BUS TRANSCEIVER, FCT SERIES	4753
SN74BCT756DW Texas Instruments	IC BUFFER INVERT 5.5V 20SOIC	223
SN75477DG4 Texas Instruments	IC PERIPHERAL DRIVER 5.5V 8SOIC	0
SN74LS243D Texas Instruments	IC TXRX NON-INVERT 5.25V 14SOIC	7
SN64BCT757N Texas Instruments	IC BUFFER NON-INVERT 5.5V 20DIP	7490
5962-8682801EA Texas Instruments	SN54HC366 HEX BUS DRIVERS WITH 3	130
SN74AHCT244MDWREP Texas Instruments	IC BUFFER NON-INVERT 5.5V 20SOIC	1749
TUSB2036AVF Texas Instruments	2/3 PORT HUB FOR THE UNIVERSAL S	10145
74AHC1G125DCKRE4 Texas Instruments	IC BUF NON-INVERT 5.5V SC70-5	0
SN74ALVTH16244GR Texas Instruments	IC BUF NON-INVERT 3.6V 48TSSOP	1480
CD54HCT244F Texas Instruments	CD54HCT244 HIGH SPEED CMOS LOGIC	120

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications