Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
SN74AVC16244ZQLR Texas Instruments	IC BUFFER NON-INVERT 3.6V 56BGA	20000
SN74LVC1G125DPWR Texas Instruments	IC BUF NON-INVERT 5.5V 4X2SON	224549000
SN74LVCH16652ADL Texas Instruments	IC TXRX NON-INVERT 3.6V 56SSOP	230
SN74BCT623NSR Texas Instruments	IC TXRX NON-INVERT 5.5V 20SO	2098
SN74LVTH245ANSR Texas Instruments	IC TXRX NON-INVERT 3.6V 20SO	0
74FCT162543CTPACT Texas Instruments	IC TXRX NON-INVERT 5.5V 56TSSOP	7847
5962-9172501M3A Texas Instruments	SN54BCT8373A SCAN TEST DEVICES W	1017
SN74HC244NSRG4 Texas Instruments	IC BUFFER NON-INVERT 6V 20SO	0
SN74LVTH240DW Texas Instruments	IC BUFFER INVERT 3.6V 20SOIC	525
SN74F126N Texas Instruments	IC BUF NON-INVERT 5.5V 14DIP	1819
SN74HC645DWG4 Texas Instruments	IC TXRX NON-INVERT 6V 20SOIC	875
5962-9950801QSA Texas Instruments	SN54LVTH240 3.3-V ABT OCTAL BUFF	407
SN74AUC1G17YEPR Texas Instruments	IC BUFFER NON-INVERT 2.7V 5DSBGA	24000
SN74LVTH16646DLR Texas Instruments	IC TXRX NON-INVERT 3.6V 56SSOP	2000
JM38510/32201BEA Texas Instruments	54LS365A HEX BUS DRIVERS WITH 3-	461
SN74LVC827ADB Texas Instruments	BUS DRIVER, LVC/LCX/Z SERIES	4920
CD74HC4049NSR Texas Instruments	IC BUFFER INVERT 6V 16SO	3190
1P1G126QDRYRQ1 Texas Instruments	IC BUFFER NON-INVERT 5.5V 6SON	4880
SN74ABT2240APW Texas Instruments	IC BUFFER INVERT 5.5V 20TSSOP	770
SN74AHCT1G126DBVR Texas Instruments	IC BUF NON-INVERT 5.5V SOT23-5	2367

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications