Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
SN74AHC245NS Texas Instruments	IC BUS TRANSCEIVER 8BIT 20SO	9760
SN74ABT240APWR Texas Instruments	IC BUFFER INVERT 5.5V 20TSSOP	2558
SN74ABT533N Texas Instruments	BUS DRIVER, ABT SERIES, 8-BIT	3040
SN74ABT2827DW Texas Instruments	IC BUF NON-INVERT 5.5V 24SOIC	345
SN74AUP1G125YZTR Texas Instruments	IC BUFFER NON-INVERT 3.6V 5DSBGA	99000
SN74LVC1G34DPWR Texas Instruments	IC BUFFER NON-INVERT 5.5V 4X2SON	228000
SN74AHC244DWR Texas Instruments	IC BUF NON-INVERT 5.5V 20SOIC	5523
SN74ALS29861DWR Texas Instruments	BUS TRANSCEIVER, ALS SERIES	1000
SN74LVCH245ARGYRG4 Texas Instruments	IC TXRX NON-INVERT 3.6V 20VQFN	0
CY74FCT240TQCT Texas Instruments	CY74FCT240T OCTAL BUFFERS/DRIVER	15570
SN74LVC240ANSR Texas Instruments	IC BUFFER INVERT 3.6V 20SO	2224
SN74HCT652NT Texas Instruments	IC TXRX NON-INVERT 5.5V 24DIP	79271
SN74LVC125ARGYRG4 Texas Instruments	IC BUF NON-INVERT 3.6V 14VQFN	0
SN74F543DBLE Texas Instruments	REGISTERED BUS TRANSCEIVER	900
SNJ54HC534J Texas Instruments	BUS DRIVER, HC/UH SERIES	0
SN74LVC126ADBR Texas Instruments	IC BUFFER NON-INVERT 3.6V 14SSOP	72742
SN74LS640N Texas Instruments	IC TXRX INVERT 5.25V 20DIP	4
SN74LVTH241PWE4 Texas Instruments	IC BUF NON-INVERT 3.6V 20TSSOP	0
SN74LVC828APWT Texas Instruments	IC BUFFER INVERT 3.6V 24TSSOP	730
SN74ABT2240ADBR Texas Instruments	IC BUFFER INVERT 5.5V 20SSOP	16000

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications