Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
SN74ABT646PW Texas Instruments	IC TXRX NON-INVERT 5.5V 24TSSOP	420
SNJ54LVTH18502AHV Texas Instruments	54LVTH18502A 3.3-V ABT SCAN TEST	140
74ACT11543DW Texas Instruments	IC TXRX NON-INVERT 5.5V 28SOIC	626
SN74LS367ANSR Texas Instruments	IC BUFFER NON-INVERT 5.25V 16SO	1886
SN74AHC125QPWRQ1 Texas Instruments	IC BUF NON-INVERT 5.5V 14TSSOP	509
SN74AC245DWR Texas Instruments	IC TXRX NON-INVERT 6V 20SOIC	1700
74FCT162646CTPVCG4 Texas Instruments	IC TXRX NON-INVERT 5.5V 56SSOP	0
CY74FCT245ATSOCT Texas Instruments	IC TXRX NON-INVERT 5.25V 20SOIC	1961
CAXC4T245QRSVRQ1 Texas Instruments	IC TRANSLATION TXRX 3.6V 16UQFN	3493
SN74ALVTH162244LR Texas Instruments	IC BUFFER NON-INVERT 3.6V 48SSOP	34695
85130012A Texas Instruments	SN54HCT244 OCTAL BUFFERS AND LIN	488
SN74AVC8T245PWRE4 Texas Instruments	IC TRANSLATION TXRX 3.6V 24TSSOP	1874
SN74HCT244PW Texas Instruments	IC BUF NON-INVERT 5.5V 20TSSOP	1037
SN74LV367ADR Texas Instruments	IC BUF NON-INVERT 5.5V 16SOIC	4150
CD74HC125M Texas Instruments	IC BUFFER NON-INVERT 6V 14SOIC	1299
SNJ54S240W Texas Instruments	54S240 OCTAL BUFFERS AND LINE DR	105
SNJ54125W Texas Instruments	BUS DRIVER	248
SN74HC658NT Texas Instruments	BUS DRIVER/TRANSCEIVER, 8-BIT	3330
74ACT11244PWR Texas Instruments	IC BUF NON-INVERT 5.5V 24TSSOP	648
SN74LVC1G06DCKR Texas Instruments	IC BUFFER INVERT 5.5V SC70-5	51039

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications