Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
SNJ54HC241FK Texas Instruments	54HC241 OCTAL BUFFERS AND LINE D	4
SNJ55ALS056J Texas Instruments	BUS DRIVER/TRANSCEIVER	45
SN74ABT244N Texas Instruments	BUS DRIVER, ABT SERIES, 4-BIT	1668
CY74FCT162543TPVCT Texas Instruments	IC TXRX NON-INVERT 5.5V 56SSOP	13000
SN74AUP1G125DCKR Texas Instruments	IC BUF NON-INVERT 3.6V SC70-5	145667
SN74LVC3G17DCTR Texas Instruments	IC BUFFER NON-INVERT 5.5V SM8	903
SN74BCT240N Texas Instruments	IC BUFFER INVERT 5.5V 20DIP	3534
SN74ALS640BDWR Texas Instruments	IC TXRX INVERT 5.5V 20SOIC	3000
SN74LVCH244ARGYRG4 Texas Instruments	IC BUF NON-INVERT 3.6V 20VQFN	0
CY74FCT646CTQCT Texas Instruments	IC TXRX NON-INVERT 5.25V 24SSOP	7500
SN74ABTH16244DLR Texas Instruments	IC BUFFER NON-INVERT 5.5V 48SSOP	15000
CY74FCT573ATQC Texas Instruments	BUS DRIVER, FCT SERIES	1995
SN74ABT241DWR Texas Instruments	BUS DRIVER, ABT SERIES, 4-BIT	1000
SN74LS240NE4 Texas Instruments	SN74LS240 OCTAL BUFFERS AND LINE	0
SN7407DRG4 Texas Instruments	IC BUF NON-INVERT 5.25V 14SOIC	0
SN74LV541ATPW Texas Instruments	IC BUF NON-INVERT 5.5V 20TSSOP	293
SN74AS645DWR Texas Instruments	IC TXRX NON-INVERT 5.5V 20SOIC	4000
SN74LVC3G07YZPR Texas Instruments	IC BUF NON-INVERT 5.5V 8DSBGA	4989
SN74F534AN Texas Instruments	BUS DRIVER	1247
SN74AHC367DGVR Texas Instruments	IC BUF NON-INVERT 5.5V 16TVSOP	2000

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications