Interface - Analog Switches - Special Purpose

Image Part Number Description / PDF Quantity Rfq
FSAV331MTCX-FS

FSAV331MTCX-FS

VIDEO MULTIPLEXER, 2 FUNC, 1 CHA

35603

TS3USBCA410RSVT

TS3USBCA410RSVT

Texas Instruments

SBU MUX 3TO1 W/ MIC AND GND

715

ISL54216IRTZ-T

ISL54216IRTZ-T

Intersil (Renesas Electronics America)

IC USB SWITCH SP3T DUAL 12TQFN

0

MAX4567CSE

MAX4567CSE

Analog Devices, Inc.

BIDIRECTIONAL RF/VIDEO SWITCH

0

PI3VDP12412NEE

PI3VDP12412NEE

Zetex Semiconductors (Diodes Inc.)

IC DEMULTIPLEXER 4LANE 48TFBGA

0

TS3V340PWR

TS3V340PWR

Texas Instruments

TS3V340 QUAD SPDT HIGH-BANDWIDTH

1654

AN15866A-VT

AN15866A-VT

Panasonic

IC VIDEO SWITCH 17IN/5OUT QFH-80

50

TS5V330CPWR

TS5V330CPWR

Texas Instruments

TS5V330C QUAD-SPDT WIDE-BANDWIDT

2819

IH5352CPE+

IH5352CPE+

Maxim Integrated

IC VIDEO SWITCH QUAD SPST 16DIP

5950

TS3L500RHURG4

TS3L500RHURG4

Texas Instruments

IC ETHERNET SWITCH 16X8 56WQFN

0

NCN7200MTTWG

NCN7200MTTWG

SINGLE-ENDED MUX, 7 FUNC, 2 CH

119087

TUSB1146IRNQR

TUSB1146IRNQR

Texas Instruments

TYPE-C USB 3.2 ALT-MODE REDRIVER

0

PI3DBS16215ZBBEX

PI3DBS16215ZBBEX

Zetex Semiconductors (Diodes Inc.)

PCIE SWITCH V-QFN2545-20

3147

TUSB1046AI-DCIRNQT

TUSB1046AI-DCIRNQT

Texas Instruments

10GBPS TYPEC DP ALT MODE REDRIVE

93

MAX14885EETL+T

MAX14885EETL+T

Maxim Integrated

IC SWITCH 2:2 DUAL GRAPH 40TQFN

0

PI5USB30213AXEAEX

PI5USB30213AXEAEX

Zetex Semiconductors (Diodes Inc.)

USB3 SWITCH,X1-QFN2040-24,T&R,3.

0

DS100MB201SQE/NOPB

DS100MB201SQE/NOPB

Texas Instruments

IC DUAL LANE MUX/BUFFER 54WQFN

191

MAX4598CWP+

MAX4598CWP+

Maxim Integrated

IC MULTIPLEXER DUAL 4X1 20SOIC

1061692

MAX4547ESE+

MAX4547ESE+

Maxim Integrated

IC VIDEO SWITCH DUAL SPDT 16SOIC

18250

AD75019JPZ

AD75019JPZ

Analog Devices, Inc.

IC CROSSPOINT SWIT 16X16 44PLCC

183

Interface - Analog Switches - Special Purpose

1. Overview

Special Purpose Analog Switches are semiconductor devices designed to route analog signals in specialized applications where standard switches cannot meet specific performance requirements. These ICs use MOSFET-based structures to control signal paths with optimized parameters for voltage range, frequency response, and signal integrity. Their importance in modern electronics stems from enabling precise signal management in critical systems like medical imaging, industrial automation, and high-frequency communication equipment.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
High-Voltage SwitchesOperate at >20V, enhanced isolationPower supply switching in test equipment
High-Frequency SwitchesGHz-range operation, low capacitanceRF signal routing in 5G infrastructure
Precision SwitchesUltra-low leakage (pA range), minimal distortionMedical diagnostic equipment sensors
High-Current SwitchesHandles >1A continuous currentIndustrial motor control systems

3. Structure and Composition

Typical architecture includes:

  • CMOS/Trench MOSFET switching elements
  • Digital control logic with level shifting
  • ESD protection structures (TVS diodes)
  • Dielectrically isolated signal paths
  • Advanced packaging (QFN, TSSOP, BGA)

Specialized variants incorporate materials like gallium nitride (GaN) for high-power applications and silicon-on-insulator (SOI) for RF performance optimization.

4. Key Technical Specifications

ParameterDescriptionImportance
RON (On-Resistance)Resistance in conducting stateAffects signal attenuation and power loss
IOFF (Off-Leakage)Current in non-conducting stateDetermines signal isolation quality
BandwidthFrequency range of effective operationLimits maximum usable signal rate
Voltage RangeOperating voltage limitsDefines system compatibility
Switching SpeedTransition time between statesImpacts real-time control capabilities

5. Application Fields

  • Telecommunications: Optical transceiver signal routing
  • Medical Equipment: MRI scanner signal multiplexing
  • Industrial Automation: PLC analog signal switching
  • Test & Measurement: Automatic test equipment (ATE) matrix switches
  • Automotive: Battery management system signal control

6. Leading Manufacturers and Products

ManufacturerProduct FamilyKey Specifications
TI (Texas Instruments)TS5A231575V, 1 RON, 40MHz bandwidth
Analog DevicesADG541244V, 150 RON, -40 C to +125 C
NXP SemiconductorsPCA9546AI2C-controlled, 4-channel, 5.5V
Maxim IntegratedMAX4735High-current, 1A rating

7. Selection Guidelines

Key considerations include:

  • Signal voltage/current requirements
  • Operating environment (temperature, vibration)
  • Parasitic capacitance for high-speed applications
  • Package type vs. board space constraints
  • Control interface compatibility (GPIO, I2C, SPI)
  • Cost vs. reliability trade-offs

8. Industry Trends Analysis

Current development directions include:

  • Miniaturization: 0.4mm pitch WLCSP packaging
  • Integration: Switches with built-in diagnostic functions
  • Wide Bandgap Materials: GaN/SiC-based switches for power applications
  • Smart Switching: Embedded digital control algorithms
  • Energy Efficiency: Sub- A quiescent current designs

Market growth is driven by 5G infrastructure (25% CAGR in RF switches) and EV battery management systems requiring high-voltage switching.

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