Interface - Analog Switches - Special Purpose

Image Part Number Description / PDF Quantity Rfq
MAX4359EAX+

MAX4359EAX+

Maxim Integrated

IC SW VIDEO CRROSSPOINT 36-SSOP

163600

MAX4540EAP+

MAX4540EAP+

Maxim Integrated

IC MULTIPLEXER DUAL 4X1 20SSOP

2481584

MAX4888CETI+T

MAX4888CETI+T

Maxim Integrated

IC SWITCH QUAD SPDT 28TQFN

17500

AD8180ARZ

AD8180ARZ

Analog Devices, Inc.

IC MULTIPLEXER 2X1 8SOIC

218

TS3L301DGVR

TS3L301DGVR

Texas Instruments

IC ETHERNET SWITCH 16X8 48TVSOP

1261

NCT51SN115T1

NCT51SN115T1

ANALOG CIRCUIT, 1 FUNC, PDSO5

132000

FSAV450QSCX

FSAV450QSCX

AUDIO/VIDEO SWITCH

24545

PI3PCIE3412AZLEX

PI3PCIE3412AZLEX

Zetex Semiconductors (Diodes Inc.)

PCIE SWITCH W-QFN3060-40 T&R 3.5

2617

PI3WVR31310AZLEX

PI3WVR31310AZLEX

Zetex Semiconductors (Diodes Inc.)

IC MUX/DEMUX 3:1 15 OHM 60TQFN

0

NL3HS2222MUTBG

NL3HS2222MUTBG

Sanyo Semiconductor/ON Semiconductor

IC USB 2.0 SWITCH DPDT UQFN10

195000

PEX8614-BA50BC G

PEX8614-BA50BC G

Broadcom

PEX8614-BA50BC G

0

MAX4936CTN+T

MAX4936CTN+T

Maxim Integrated

IC TRANSMIT/RCVR SWITCH 56-TQFN

0

MAX9392EHJ+T

MAX9392EHJ+T

Maxim Integrated

IC CROSSPOINT SWITCH DUAL 32TQFP

2500

MAX9655AEE+

MAX9655AEE+

Analog Devices, Inc.

VIDEO SWITCHES FOR DUAL SCART

13100

FSUSB43L10X

FSUSB43L10X

Sanyo Semiconductor/ON Semiconductor

IC USB MUX/SWITCH 10MICROPAK

1380

ADG2128BCPZ-REEL

ADG2128BCPZ-REEL

Analog Devices, Inc.

CROSS POINT SWITCH, 12 CHANNEL,

2130

MAX4546EPE

MAX4546EPE

Analog Devices, Inc.

BIDIRECTIONAL RF/VIDEO SWITCH

2545

HD3SS460RHRR

HD3SS460RHRR

Texas Instruments

IC MUX 6:4 14 OHM 28WFQFN

3277

HV2201PJ-G-M904

HV2201PJ-G-M904

Roving Networks / Microchip Technology

IC ULTRASOUND SWITCH 1:1 28PLCC

236

FSA2357BQX

FSA2357BQX

AUDIO/VIDEO SWITCH

48000

Interface - Analog Switches - Special Purpose

1. Overview

Special Purpose Analog Switches are semiconductor devices designed to route analog signals in specialized applications where standard switches cannot meet specific performance requirements. These ICs use MOSFET-based structures to control signal paths with optimized parameters for voltage range, frequency response, and signal integrity. Their importance in modern electronics stems from enabling precise signal management in critical systems like medical imaging, industrial automation, and high-frequency communication equipment.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
High-Voltage SwitchesOperate at >20V, enhanced isolationPower supply switching in test equipment
High-Frequency SwitchesGHz-range operation, low capacitanceRF signal routing in 5G infrastructure
Precision SwitchesUltra-low leakage (pA range), minimal distortionMedical diagnostic equipment sensors
High-Current SwitchesHandles >1A continuous currentIndustrial motor control systems

3. Structure and Composition

Typical architecture includes:

  • CMOS/Trench MOSFET switching elements
  • Digital control logic with level shifting
  • ESD protection structures (TVS diodes)
  • Dielectrically isolated signal paths
  • Advanced packaging (QFN, TSSOP, BGA)

Specialized variants incorporate materials like gallium nitride (GaN) for high-power applications and silicon-on-insulator (SOI) for RF performance optimization.

4. Key Technical Specifications

ParameterDescriptionImportance
RON (On-Resistance)Resistance in conducting stateAffects signal attenuation and power loss
IOFF (Off-Leakage)Current in non-conducting stateDetermines signal isolation quality
BandwidthFrequency range of effective operationLimits maximum usable signal rate
Voltage RangeOperating voltage limitsDefines system compatibility
Switching SpeedTransition time between statesImpacts real-time control capabilities

5. Application Fields

  • Telecommunications: Optical transceiver signal routing
  • Medical Equipment: MRI scanner signal multiplexing
  • Industrial Automation: PLC analog signal switching
  • Test & Measurement: Automatic test equipment (ATE) matrix switches
  • Automotive: Battery management system signal control

6. Leading Manufacturers and Products

ManufacturerProduct FamilyKey Specifications
TI (Texas Instruments)TS5A231575V, 1 RON, 40MHz bandwidth
Analog DevicesADG541244V, 150 RON, -40 C to +125 C
NXP SemiconductorsPCA9546AI2C-controlled, 4-channel, 5.5V
Maxim IntegratedMAX4735High-current, 1A rating

7. Selection Guidelines

Key considerations include:

  • Signal voltage/current requirements
  • Operating environment (temperature, vibration)
  • Parasitic capacitance for high-speed applications
  • Package type vs. board space constraints
  • Control interface compatibility (GPIO, I2C, SPI)
  • Cost vs. reliability trade-offs

8. Industry Trends Analysis

Current development directions include:

  • Miniaturization: 0.4mm pitch WLCSP packaging
  • Integration: Switches with built-in diagnostic functions
  • Wide Bandgap Materials: GaN/SiC-based switches for power applications
  • Smart Switching: Embedded digital control algorithms
  • Energy Efficiency: Sub- A quiescent current designs

Market growth is driven by 5G infrastructure (25% CAGR in RF switches) and EV battery management systems requiring high-voltage switching.

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