Interface - Analog Switches - Special Purpose

Image Part Number Description / PDF Quantity Rfq
HV2762GA-G

HV2762GA-G

Roving Networks / Microchip Technology

IC SWITCH SPST 50MHZ 64VFBGA

416

NL3S22AHMUTAG

NL3S22AHMUTAG

Sanyo Semiconductor/ON Semiconductor

USB 2.0 + AUDIO SWITCH

0

PEX8733-CA80BC G

PEX8733-CA80BC G

Broadcom

CIE INTERFACE IC 32 LANE GEN 3

0

TS5USBC412YFFT

TS5USBC412YFFT

Texas Instruments

DUAL 2:1 USB 2.0 MUX/DEMUX OR SI

740

ISL59530IKZ

ISL59530IKZ

Intersil (Renesas Electronics America)

XPOINT SWITCH, 16 CH, PBGA356

181

HA4314BCA

HA4314BCA

CROSS POINT SWITCH, 4 CHANNEL,

2472

MAX4549EAX+T

MAX4549EAX+T

Maxim Integrated

IC AUD/VIDCROSSPOINT SWIT 36SSOP

0

TS3L501ERUAR

TS3L501ERUAR

Texas Instruments

TS3L501E 16-BIT TO 8-BIT MULTIPL

128

NL3S588MUTBG

NL3S588MUTBG

Sanyo Semiconductor/ON Semiconductor

IC SWITCH AUDIO USB DPDT 10UQFN

5630

MAX4888BETI+

MAX4888BETI+

Maxim Integrated

IC SWITCH QUAD DPDT 28TQFN

713

FSA223L10X

FSA223L10X

DPDT, 1 FUNC, PQCC10

24920

NX3DV2567HR-Q100X

NX3DV2567HR-Q100X

NXP Semiconductors

IC ANLG SWITCH 4PDT 16HXQFN

849

ISL54207IRUZ-T

ISL54207IRUZ-T

Intersil (Renesas Electronics America)

SPDT, 2 FUNC, PQCC10

2007

PI2USB3212ZHE

PI2USB3212ZHE

Zetex Semiconductors (Diodes Inc.)

IC MUX/DEMUX 1X2 28TQFN

26

PI5V330AQEX

PI5V330AQEX

Zetex Semiconductors (Diodes Inc.)

IC SWITCH 2:1 10 OHM RGB 16SSOP

0

FSA9285AUCX

FSA9285AUCX

MCPC-COMPLIANT, USB-PORT, MULTIM

162000

ADG751BRMZ

ADG751BRMZ

Analog Devices, Inc.

SPST, 1 CHANNEL, CMOS

19514

PI3CH3244LE

PI3CH3244LE

Zetex Semiconductors (Diodes Inc.)

IC SWITCH SPST 8 OHM 20TSSOP

13912

HV2601FG-G

HV2601FG-G

Roving Networks / Microchip Technology

IC SWITCH SPST 38 OHM 48LQFP

542

MAX311CPE

MAX311CPE

Analog Devices, Inc.

MAX311 CMOS RF/VIDEO MULTIPLEXER

2156

Interface - Analog Switches - Special Purpose

1. Overview

Special Purpose Analog Switches are semiconductor devices designed to route analog signals in specialized applications where standard switches cannot meet specific performance requirements. These ICs use MOSFET-based structures to control signal paths with optimized parameters for voltage range, frequency response, and signal integrity. Their importance in modern electronics stems from enabling precise signal management in critical systems like medical imaging, industrial automation, and high-frequency communication equipment.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
High-Voltage SwitchesOperate at >20V, enhanced isolationPower supply switching in test equipment
High-Frequency SwitchesGHz-range operation, low capacitanceRF signal routing in 5G infrastructure
Precision SwitchesUltra-low leakage (pA range), minimal distortionMedical diagnostic equipment sensors
High-Current SwitchesHandles >1A continuous currentIndustrial motor control systems

3. Structure and Composition

Typical architecture includes:

  • CMOS/Trench MOSFET switching elements
  • Digital control logic with level shifting
  • ESD protection structures (TVS diodes)
  • Dielectrically isolated signal paths
  • Advanced packaging (QFN, TSSOP, BGA)

Specialized variants incorporate materials like gallium nitride (GaN) for high-power applications and silicon-on-insulator (SOI) for RF performance optimization.

4. Key Technical Specifications

ParameterDescriptionImportance
RON (On-Resistance)Resistance in conducting stateAffects signal attenuation and power loss
IOFF (Off-Leakage)Current in non-conducting stateDetermines signal isolation quality
BandwidthFrequency range of effective operationLimits maximum usable signal rate
Voltage RangeOperating voltage limitsDefines system compatibility
Switching SpeedTransition time between statesImpacts real-time control capabilities

5. Application Fields

  • Telecommunications: Optical transceiver signal routing
  • Medical Equipment: MRI scanner signal multiplexing
  • Industrial Automation: PLC analog signal switching
  • Test & Measurement: Automatic test equipment (ATE) matrix switches
  • Automotive: Battery management system signal control

6. Leading Manufacturers and Products

ManufacturerProduct FamilyKey Specifications
TI (Texas Instruments)TS5A231575V, 1 RON, 40MHz bandwidth
Analog DevicesADG541244V, 150 RON, -40 C to +125 C
NXP SemiconductorsPCA9546AI2C-controlled, 4-channel, 5.5V
Maxim IntegratedMAX4735High-current, 1A rating

7. Selection Guidelines

Key considerations include:

  • Signal voltage/current requirements
  • Operating environment (temperature, vibration)
  • Parasitic capacitance for high-speed applications
  • Package type vs. board space constraints
  • Control interface compatibility (GPIO, I2C, SPI)
  • Cost vs. reliability trade-offs

8. Industry Trends Analysis

Current development directions include:

  • Miniaturization: 0.4mm pitch WLCSP packaging
  • Integration: Switches with built-in diagnostic functions
  • Wide Bandgap Materials: GaN/SiC-based switches for power applications
  • Smart Switching: Embedded digital control algorithms
  • Energy Efficiency: Sub- A quiescent current designs

Market growth is driven by 5G infrastructure (25% CAGR in RF switches) and EV battery management systems requiring high-voltage switching.

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