Interface - Analog Switches - Special Purpose

Image Part Number Description / PDF Quantity Rfq
HT1204DC

HT1204DC

Honeywell Aerospace

IC ANLG SW QUAD HI TEMP 14DIP

11

ADV3226ACPZ

ADV3226ACPZ

Analog Devices, Inc.

IC CROSSPOINT SW 16X16 100LFCSP

16

MAX4547CSE+

MAX4547CSE+

Maxim Integrated

IC VIDEO SWITCH DUAL SPDT 16SOIC

85750

MAX4554ESE+T

MAX4554ESE+T

Maxim Integrated

FORCE-SENSE SWITCHES

0

MAX4547CEE+T

MAX4547CEE+T

Maxim Integrated

IC VIDEO SWITCH DUAL SPDT 16QSOP

0

OPA875ID

OPA875ID

Texas Instruments

OPA875 SINGLE 2:1 HIGH-SPEED VID

7595

PI3L720ZHE-1507

PI3L720ZHE-1507

Zetex Semiconductors (Diodes Inc.)

IC 2:1 MUX/DEMUX 42TQFN

0

PEX8718-AB80BI G

PEX8718-AB80BI G

Broadcom

PEX8718-AB80BI G

3843

MAX4554CSE+

MAX4554CSE+

Maxim Integrated

IC SWITCH DUAL 3PST 16SOIC

41

HD3SS6126RUAR

HD3SS6126RUAR

Texas Instruments

IC MUX 2:1 8 OHM 42WQFN

0

ADG752BRTZ-REEL7

ADG752BRTZ-REEL7

Analog Devices, Inc.

IC VIDEO SWITCH SPDT SOT23-6

1958

TUSB1042IRNQT

TUSB1042IRNQT

Texas Instruments

10G USB3.1G2 2-1 LINEAR REDRIVER

161

HD3SS460IRHRT

HD3SS460IRHRT

Texas Instruments

IC MUX/DEMUX 4CH TYPE C2 28WQFN

311

TS3V340D

TS3V340D

Texas Instruments

IC VIDEO SWITCH QUAD SPDT 16SOIC

474

HV20822FG-G-M931

HV20822FG-G-M931

Roving Networks / Microchip Technology

IC SWITCH SPST 32 OHM 48LQFP

1397

HD3SS212ZQET

HD3SS212ZQET

Texas Instruments

IC DISPLYPRT 2:1 DIFF SW 48BGA

23810000

TS3V340DBQR

TS3V340DBQR

Texas Instruments

TS3V340 QUAD SPDT HIGH-BANDWIDTH

111129

ISL54224IRUZ-T

ISL54224IRUZ-T

Intersil (Renesas Electronics America)

IC MULTIPLEXER DUAL 2:1 10TQFN

0

TS3V713ELRTGR

TS3V713ELRTGR

Texas Instruments

TS3V713EL 7-CHANNEL, 1:2 VIDEO S

49999

PI3WVR12412ZHE+DRX

PI3WVR12412ZHE+DRX

Zetex Semiconductors (Diodes Inc.)

DISPLAY SWITCH V-QFN3590-42 T&R

0

Interface - Analog Switches - Special Purpose

1. Overview

Special Purpose Analog Switches are semiconductor devices designed to route analog signals in specialized applications where standard switches cannot meet specific performance requirements. These ICs use MOSFET-based structures to control signal paths with optimized parameters for voltage range, frequency response, and signal integrity. Their importance in modern electronics stems from enabling precise signal management in critical systems like medical imaging, industrial automation, and high-frequency communication equipment.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
High-Voltage SwitchesOperate at >20V, enhanced isolationPower supply switching in test equipment
High-Frequency SwitchesGHz-range operation, low capacitanceRF signal routing in 5G infrastructure
Precision SwitchesUltra-low leakage (pA range), minimal distortionMedical diagnostic equipment sensors
High-Current SwitchesHandles >1A continuous currentIndustrial motor control systems

3. Structure and Composition

Typical architecture includes:

  • CMOS/Trench MOSFET switching elements
  • Digital control logic with level shifting
  • ESD protection structures (TVS diodes)
  • Dielectrically isolated signal paths
  • Advanced packaging (QFN, TSSOP, BGA)

Specialized variants incorporate materials like gallium nitride (GaN) for high-power applications and silicon-on-insulator (SOI) for RF performance optimization.

4. Key Technical Specifications

ParameterDescriptionImportance
RON (On-Resistance)Resistance in conducting stateAffects signal attenuation and power loss
IOFF (Off-Leakage)Current in non-conducting stateDetermines signal isolation quality
BandwidthFrequency range of effective operationLimits maximum usable signal rate
Voltage RangeOperating voltage limitsDefines system compatibility
Switching SpeedTransition time between statesImpacts real-time control capabilities

5. Application Fields

  • Telecommunications: Optical transceiver signal routing
  • Medical Equipment: MRI scanner signal multiplexing
  • Industrial Automation: PLC analog signal switching
  • Test & Measurement: Automatic test equipment (ATE) matrix switches
  • Automotive: Battery management system signal control

6. Leading Manufacturers and Products

ManufacturerProduct FamilyKey Specifications
TI (Texas Instruments)TS5A231575V, 1 RON, 40MHz bandwidth
Analog DevicesADG541244V, 150 RON, -40 C to +125 C
NXP SemiconductorsPCA9546AI2C-controlled, 4-channel, 5.5V
Maxim IntegratedMAX4735High-current, 1A rating

7. Selection Guidelines

Key considerations include:

  • Signal voltage/current requirements
  • Operating environment (temperature, vibration)
  • Parasitic capacitance for high-speed applications
  • Package type vs. board space constraints
  • Control interface compatibility (GPIO, I2C, SPI)
  • Cost vs. reliability trade-offs

8. Industry Trends Analysis

Current development directions include:

  • Miniaturization: 0.4mm pitch WLCSP packaging
  • Integration: Switches with built-in diagnostic functions
  • Wide Bandgap Materials: GaN/SiC-based switches for power applications
  • Smart Switching: Embedded digital control algorithms
  • Energy Efficiency: Sub- A quiescent current designs

Market growth is driven by 5G infrastructure (25% CAGR in RF switches) and EV battery management systems requiring high-voltage switching.

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