Interface - Analog Switches - Special Purpose

Image Part Number Description / PDF Quantity Rfq
MAX4888ETI+

MAX4888ETI+

Maxim Integrated

IC SWITCH QUAD SPDT 28TQFN

1311210

ISL54207IRZ

ISL54207IRZ

Intersil (Renesas Electronics America)

SPDT, 2 FUNC, 1 CHANNEL, CMOS

2350

AD8108ASTZ

AD8108ASTZ

Analog Devices, Inc.

IC VIDEO CROSSPOINT SWIT 80LQFP

23

TS3USBCA420RSVT

TS3USBCA420RSVT

Texas Instruments

SBU MUX W/ MIC AND GND

730

CBTL06122AHF,518

CBTL06122AHF,518

NXP Semiconductors

IC MULTIPLEXER HEX 1X2 56HWQFN

465

MAX4359EAX

MAX4359EAX

Analog Devices, Inc.

MAX4359 4X4 VIDEO XPOINT SWITCH

0

NCN1188MUTAG

NCN1188MUTAG

Sanyo Semiconductor/ON Semiconductor

IC USB SWITCH 3:1 AUD/MHL 12UQFN

2146

PI2DDR3212ZLEX

PI2DDR3212ZLEX

Zetex Semiconductors (Diodes Inc.)

IC SWITCH 2:1 DDR3 14BIT 52TQFN

0

LMH1251MTX/NOPB

LMH1251MTX/NOPB

Texas Instruments

AUDIO/VIDEO SWITCH, PDSO24

57374

MAX14805CCM+

MAX14805CCM+

Analog Devices, Inc.

SPST, 2 FUNC, 8 CHANNEL, BICMOS,

225

TS5L100PWR

TS5L100PWR

Texas Instruments

TS5L100 QUAD-SPDT WIDE-BANDWIDTH

7950

TUSB1046-DCIRNQT

TUSB1046-DCIRNQT

Texas Instruments

IC SWITCH 10GBPS 10 OHM 40WQFN

1098

FSA2866UMX

FSA2866UMX

Sanyo Semiconductor/ON Semiconductor

IC ANALOG SWITCH 20UMLP

1026

FSUSB22BQX

FSUSB22BQX

DPDT, 2 FUNC, 1 CHANNEL

100108

TS5USBC402IYFPR

TS5USBC402IYFPR

Texas Instruments

TS5USBC402

0

LMH6574MAX/NOPB

LMH6574MAX/NOPB

Texas Instruments

IC VIDEO MULTIPLEXER 4X1 14SOIC

3760

MAX4546CEE

MAX4546CEE

Analog Devices, Inc.

BIDIRECTIONAL RF/VIDEO SWITCH

1300

TUSB1146RNQT

TUSB1146RNQT

Texas Instruments

USB TYPE C REDRIVER /MUX

243

MAX4908ETD+TCFD

MAX4908ETD+TCFD

Maxim Integrated

IC MULTIPLEXER DUAL 3X1 14TDFN

0

PI3USB302-AZBEX

PI3USB302-AZBEX

Zetex Semiconductors (Diodes Inc.)

IC MUX/DEMUX USB 3.0 20TQFN

4738

Interface - Analog Switches - Special Purpose

1. Overview

Special Purpose Analog Switches are semiconductor devices designed to route analog signals in specialized applications where standard switches cannot meet specific performance requirements. These ICs use MOSFET-based structures to control signal paths with optimized parameters for voltage range, frequency response, and signal integrity. Their importance in modern electronics stems from enabling precise signal management in critical systems like medical imaging, industrial automation, and high-frequency communication equipment.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
High-Voltage SwitchesOperate at >20V, enhanced isolationPower supply switching in test equipment
High-Frequency SwitchesGHz-range operation, low capacitanceRF signal routing in 5G infrastructure
Precision SwitchesUltra-low leakage (pA range), minimal distortionMedical diagnostic equipment sensors
High-Current SwitchesHandles >1A continuous currentIndustrial motor control systems

3. Structure and Composition

Typical architecture includes:

  • CMOS/Trench MOSFET switching elements
  • Digital control logic with level shifting
  • ESD protection structures (TVS diodes)
  • Dielectrically isolated signal paths
  • Advanced packaging (QFN, TSSOP, BGA)

Specialized variants incorporate materials like gallium nitride (GaN) for high-power applications and silicon-on-insulator (SOI) for RF performance optimization.

4. Key Technical Specifications

ParameterDescriptionImportance
RON (On-Resistance)Resistance in conducting stateAffects signal attenuation and power loss
IOFF (Off-Leakage)Current in non-conducting stateDetermines signal isolation quality
BandwidthFrequency range of effective operationLimits maximum usable signal rate
Voltage RangeOperating voltage limitsDefines system compatibility
Switching SpeedTransition time between statesImpacts real-time control capabilities

5. Application Fields

  • Telecommunications: Optical transceiver signal routing
  • Medical Equipment: MRI scanner signal multiplexing
  • Industrial Automation: PLC analog signal switching
  • Test & Measurement: Automatic test equipment (ATE) matrix switches
  • Automotive: Battery management system signal control

6. Leading Manufacturers and Products

ManufacturerProduct FamilyKey Specifications
TI (Texas Instruments)TS5A231575V, 1 RON, 40MHz bandwidth
Analog DevicesADG541244V, 150 RON, -40 C to +125 C
NXP SemiconductorsPCA9546AI2C-controlled, 4-channel, 5.5V
Maxim IntegratedMAX4735High-current, 1A rating

7. Selection Guidelines

Key considerations include:

  • Signal voltage/current requirements
  • Operating environment (temperature, vibration)
  • Parasitic capacitance for high-speed applications
  • Package type vs. board space constraints
  • Control interface compatibility (GPIO, I2C, SPI)
  • Cost vs. reliability trade-offs

8. Industry Trends Analysis

Current development directions include:

  • Miniaturization: 0.4mm pitch WLCSP packaging
  • Integration: Switches with built-in diagnostic functions
  • Wide Bandgap Materials: GaN/SiC-based switches for power applications
  • Smart Switching: Embedded digital control algorithms
  • Energy Efficiency: Sub- A quiescent current designs

Market growth is driven by 5G infrastructure (25% CAGR in RF switches) and EV battery management systems requiring high-voltage switching.

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