Interface - Analog Switches - Special Purpose

Image Part Number Description / PDF Quantity Rfq
ISL54211IRUZ-T

ISL54211IRUZ-T

Intersil (Renesas Electronics America)

IC SWITCH DUAL SPDT HS 10-TQFN

0

MT8816AF1

MT8816AF1

Roving Networks / Microchip Technology

IC ANLG SWITCH ARRAY 8X16 44TQFP

163

NCS6415DWG

NCS6415DWG

VIDEO MULTIPLEXER

51300

TS5USBC410IYFFR

TS5USBC410IYFFR

Texas Instruments

TS5USBC410IYFFR

0

PEX8606-BA50BI G

PEX8606-BA50BI G

Broadcom

IC PCI EXPRESS SWITCH 196BGA

0

TS5USBC402YFPT

TS5USBC402YFPT

Texas Instruments

DUAL 2:1 USB 2.0 MUX/DEMUX OR SI

690

MAX4885ETJ+

MAX4885ETJ+

Maxim Integrated

IC SWITCH 2X1 32TQFN

1711380

FSUSB45UMX

FSUSB45UMX

Sanyo Semiconductor/ON Semiconductor

IC USB SWITCH DPDT 10UMLP

105000

TS3USB221DRCR

TS3USB221DRCR

Texas Instruments

IC USB SWITCH DUAL 1X2 10SON

876

PI3V512QEX

PI3V512QEX

Zetex Semiconductors (Diodes Inc.)

IC SWITCH 2:1 5 PORT 24QSOP

0

MAX4555CSE

MAX4555CSE

Analog Devices, Inc.

MAX4555 FORCE-SENSE SWITCH

390

HV2705FG-G

HV2705FG-G

Roving Networks / Microchip Technology

IC SWITCH SPST 38 OHM 48LQFP

139

HV2902GA-G

HV2902GA-G

Roving Networks / Microchip Technology

IC SWITCH 32 X SPST 78VFBGA

510

TC7WBL3306CFK(5L,F

TC7WBL3306CFK(5L,F

Toshiba Electronic Devices and Storage Corporation

IC USB SWITCH SPST DUAL US8

2295

TC7WBL3305CFK,LF

TC7WBL3305CFK,LF

Toshiba Electronic Devices and Storage Corporation

IC USB SWITCH SPST DUAL US8

6820

MAX4567CPE

MAX4567CPE

Analog Devices, Inc.

BIDIRECTIONAL RF/VIDEO SWITCH

129

ISL54222AIUZ-T

ISL54222AIUZ-T

Intersil (Renesas Electronics America)

IC MULTIPLEXER DUAL 2X1 10MSOP

0

MAX4358ECE+D

MAX4358ECE+D

Analog Devices, Inc.

NONBLOCKING VIDEO XPOINT SWITCH

247

AD8186ARUZ-R7

AD8186ARUZ-R7

Analog Devices, Inc.

VIDEO MUX, 3 FUNC, 2 CHANNEL

9454

MAX4589CPP

MAX4589CPP

Analog Devices, Inc.

DUAL 2-CH RF/VIDEO MUX

37

Interface - Analog Switches - Special Purpose

1. Overview

Special Purpose Analog Switches are semiconductor devices designed to route analog signals in specialized applications where standard switches cannot meet specific performance requirements. These ICs use MOSFET-based structures to control signal paths with optimized parameters for voltage range, frequency response, and signal integrity. Their importance in modern electronics stems from enabling precise signal management in critical systems like medical imaging, industrial automation, and high-frequency communication equipment.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
High-Voltage SwitchesOperate at >20V, enhanced isolationPower supply switching in test equipment
High-Frequency SwitchesGHz-range operation, low capacitanceRF signal routing in 5G infrastructure
Precision SwitchesUltra-low leakage (pA range), minimal distortionMedical diagnostic equipment sensors
High-Current SwitchesHandles >1A continuous currentIndustrial motor control systems

3. Structure and Composition

Typical architecture includes:

  • CMOS/Trench MOSFET switching elements
  • Digital control logic with level shifting
  • ESD protection structures (TVS diodes)
  • Dielectrically isolated signal paths
  • Advanced packaging (QFN, TSSOP, BGA)

Specialized variants incorporate materials like gallium nitride (GaN) for high-power applications and silicon-on-insulator (SOI) for RF performance optimization.

4. Key Technical Specifications

ParameterDescriptionImportance
RON (On-Resistance)Resistance in conducting stateAffects signal attenuation and power loss
IOFF (Off-Leakage)Current in non-conducting stateDetermines signal isolation quality
BandwidthFrequency range of effective operationLimits maximum usable signal rate
Voltage RangeOperating voltage limitsDefines system compatibility
Switching SpeedTransition time between statesImpacts real-time control capabilities

5. Application Fields

  • Telecommunications: Optical transceiver signal routing
  • Medical Equipment: MRI scanner signal multiplexing
  • Industrial Automation: PLC analog signal switching
  • Test & Measurement: Automatic test equipment (ATE) matrix switches
  • Automotive: Battery management system signal control

6. Leading Manufacturers and Products

ManufacturerProduct FamilyKey Specifications
TI (Texas Instruments)TS5A231575V, 1 RON, 40MHz bandwidth
Analog DevicesADG541244V, 150 RON, -40 C to +125 C
NXP SemiconductorsPCA9546AI2C-controlled, 4-channel, 5.5V
Maxim IntegratedMAX4735High-current, 1A rating

7. Selection Guidelines

Key considerations include:

  • Signal voltage/current requirements
  • Operating environment (temperature, vibration)
  • Parasitic capacitance for high-speed applications
  • Package type vs. board space constraints
  • Control interface compatibility (GPIO, I2C, SPI)
  • Cost vs. reliability trade-offs

8. Industry Trends Analysis

Current development directions include:

  • Miniaturization: 0.4mm pitch WLCSP packaging
  • Integration: Switches with built-in diagnostic functions
  • Wide Bandgap Materials: GaN/SiC-based switches for power applications
  • Smart Switching: Embedded digital control algorithms
  • Energy Efficiency: Sub- A quiescent current designs

Market growth is driven by 5G infrastructure (25% CAGR in RF switches) and EV battery management systems requiring high-voltage switching.

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