Interface - Analog Switches - Special Purpose

Image Part Number Description / PDF Quantity Rfq
HD3SS213ZQER

HD3SS213ZQER

Texas Instruments

IC DISPLYPRT 2:1 DIFF SW 50BGA

0

HMC728LC3CTR

HMC728LC3CTR

Analog Devices, Inc.

IC SELECTOR 2:1 14GBPS 16QFN

0

MAX4566CEE+

MAX4566CEE+

Maxim Integrated

IC VIDEO SWITCH DUAL SPST 16QSOP

0

PI2DDR3212NCE

PI2DDR3212NCE

Zetex Semiconductors (Diodes Inc.)

IC MUX/DEMUX 14 X 2:1 48TFBGA

0

TPS66021YBGR

TPS66021YBGR

Texas Instruments

SOURCE AND SINK POWER MULTIPEXER

2826

TS3L100DGVR

TS3L100DGVR

Texas Instruments

TS3L100 QUAD-SPDT WIDE-BANDWIDTH

14000

HV209FG-G

HV209FG-G

Roving Networks / Microchip Technology

IC SWITCH 12 X SPDT 38OHM 48LQFP

185

ISL76120ARTZ-T7A

ISL76120ARTZ-T7A

Intersil (Renesas Electronics America)

IC MULTIPLEXER DUAL SPDT 10TDFN

0

FSA2267L10X

FSA2267L10X

Sanyo Semiconductor/ON Semiconductor

IC SWITCH DUAL SPDT 10MICROPAK

502140000

MAX4554CSE

MAX4554CSE

Analog Devices, Inc.

MAX4554 FORCE-SENSE SWITCH

229

MAX4547CEE

MAX4547CEE

Analog Devices, Inc.

BIDIRECTIONAL RF/VIDEO SWITCH

765

MAX310CWN+

MAX310CWN+

Maxim Integrated

IC VIDEO MULTIPLEXER 8X1 18SOIC

31640

MAX4571CEI+T

MAX4571CEI+T

Maxim Integrated

IC AUD/VID SWITCH SRL 28QSOP

12500

HV2801K6-G

HV2801K6-G

Roving Networks / Microchip Technology

IC SWITCH 2:1 50MHZ 64QFN

0

PI3L500-AZFEX

PI3L500-AZFEX

Zetex Semiconductors (Diodes Inc.)

IC MUX/DEMUX 8 X 2:1 56TQFN

0

MAX4904EBL+T

MAX4904EBL+T

Analog Devices, Inc.

MAX4904 LOW-RON, SINGLE-SPDT CLI

5000

PI5V330AQE

PI5V330AQE

Zetex Semiconductors (Diodes Inc.)

IC VIDEO MUX/DEMUX 2X1 16QSOP

0

MAX4565EAP+

MAX4565EAP+

Maxim Integrated

IC SW QUAD VIDEO BIDIRECT 20SSOP

1441716

HV2701FG-G-M931

HV2701FG-G-M931

Roving Networks / Microchip Technology

IC SWITCH SPST 38 OHM 48LQFP

159

TS3USB3200RSVR

TS3USB3200RSVR

Texas Instruments

IC SW USB/MHL DPDT 16UQFN

2532

Interface - Analog Switches - Special Purpose

1. Overview

Special Purpose Analog Switches are semiconductor devices designed to route analog signals in specialized applications where standard switches cannot meet specific performance requirements. These ICs use MOSFET-based structures to control signal paths with optimized parameters for voltage range, frequency response, and signal integrity. Their importance in modern electronics stems from enabling precise signal management in critical systems like medical imaging, industrial automation, and high-frequency communication equipment.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
High-Voltage SwitchesOperate at >20V, enhanced isolationPower supply switching in test equipment
High-Frequency SwitchesGHz-range operation, low capacitanceRF signal routing in 5G infrastructure
Precision SwitchesUltra-low leakage (pA range), minimal distortionMedical diagnostic equipment sensors
High-Current SwitchesHandles >1A continuous currentIndustrial motor control systems

3. Structure and Composition

Typical architecture includes:

  • CMOS/Trench MOSFET switching elements
  • Digital control logic with level shifting
  • ESD protection structures (TVS diodes)
  • Dielectrically isolated signal paths
  • Advanced packaging (QFN, TSSOP, BGA)

Specialized variants incorporate materials like gallium nitride (GaN) for high-power applications and silicon-on-insulator (SOI) for RF performance optimization.

4. Key Technical Specifications

ParameterDescriptionImportance
RON (On-Resistance)Resistance in conducting stateAffects signal attenuation and power loss
IOFF (Off-Leakage)Current in non-conducting stateDetermines signal isolation quality
BandwidthFrequency range of effective operationLimits maximum usable signal rate
Voltage RangeOperating voltage limitsDefines system compatibility
Switching SpeedTransition time between statesImpacts real-time control capabilities

5. Application Fields

  • Telecommunications: Optical transceiver signal routing
  • Medical Equipment: MRI scanner signal multiplexing
  • Industrial Automation: PLC analog signal switching
  • Test & Measurement: Automatic test equipment (ATE) matrix switches
  • Automotive: Battery management system signal control

6. Leading Manufacturers and Products

ManufacturerProduct FamilyKey Specifications
TI (Texas Instruments)TS5A231575V, 1 RON, 40MHz bandwidth
Analog DevicesADG541244V, 150 RON, -40 C to +125 C
NXP SemiconductorsPCA9546AI2C-controlled, 4-channel, 5.5V
Maxim IntegratedMAX4735High-current, 1A rating

7. Selection Guidelines

Key considerations include:

  • Signal voltage/current requirements
  • Operating environment (temperature, vibration)
  • Parasitic capacitance for high-speed applications
  • Package type vs. board space constraints
  • Control interface compatibility (GPIO, I2C, SPI)
  • Cost vs. reliability trade-offs

8. Industry Trends Analysis

Current development directions include:

  • Miniaturization: 0.4mm pitch WLCSP packaging
  • Integration: Switches with built-in diagnostic functions
  • Wide Bandgap Materials: GaN/SiC-based switches for power applications
  • Smart Switching: Embedded digital control algorithms
  • Energy Efficiency: Sub- A quiescent current designs

Market growth is driven by 5G infrastructure (25% CAGR in RF switches) and EV battery management systems requiring high-voltage switching.

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