Interface - Analog Switches - Special Purpose

Image Part Number Description / PDF Quantity Rfq
PI3V724ZLEX

PI3V724ZLEX

Zetex Semiconductors (Diodes Inc.)

IC MUX/DEMUX 2:1 5.6 OHM 32TQFN

0

FSAV332MTCX

FSAV332MTCX

SPST, 4 FUNC, 1 CHANNEL

14694

PI3VDP3212ZLEX

PI3VDP3212ZLEX

Zetex Semiconductors (Diodes Inc.)

IC DEMULTIPLEXER 2LANE 32TQFN

0

TUSB1146RNQR

TUSB1146RNQR

Texas Instruments

TYPE-C USB 3.2 ALT-MODE REDRIVER

0

TS3USB221RSERG4

TS3USB221RSERG4

Texas Instruments

IC USB SWITCH DUAL 1X2 10UQFN

0

OPA875IDGKR

OPA875IDGKR

Texas Instruments

IC VIDEO MUX 2:1 8VSSOP

2421

MAX4566CPE

MAX4566CPE

Analog Devices, Inc.

BIDIRECTIONAL RF/VIDEO SWITCH

383

NLAS7222AMTR2G

NLAS7222AMTR2G

Sanyo Semiconductor/ON Semiconductor

IC USB SWITCH DPDT 10WQFN

995

PEX8724-CA80BC G

PEX8724-CA80BC G

Broadcom

IC PCI EXPRESS SWITCH 324FCBGA

0

ISL54224IRTZ-T

ISL54224IRTZ-T

Intersil (Renesas Electronics America)

IC MULTIPLEXER DUAL 2:1 10TDFN

0

HD3SS212ZQER

HD3SS212ZQER

Texas Instruments

IC DISPLYPRT 2:1 DIFF SW 48BGA

14877500

PEX8732-CA80BC G

PEX8732-CA80BC G

Broadcom

IC PCI EXPRESS SWITCH 676FCBGA

360

AD8182ARZ-RL

AD8182ARZ-RL

Analog Devices, Inc.

IC MULTIPLEXER DUAL 2X1 14SOIC

0

MAX4571CEI+

MAX4571CEI+

Maxim Integrated

IC AUD/VID SWITCH SRL 28QSOP

3000

ISL54405IVZ-T

ISL54405IVZ-T

Intersil (Renesas Electronics America)

SPDT, 2 FUNC, CMOS, PDSO16

2500

TS5V330PWR

TS5V330PWR

Texas Instruments

IC VIDEO SWIT QUAD SPDT 16TSSOP

90

AD8178ABPZ

AD8178ABPZ

Analog Devices, Inc.

CROSS POINT SWITCH

109

HA4314BCB

HA4314BCB

CROSS POINT SWITCH, 4 CHANNEL,

107

MAX20328EWA+

MAX20328EWA+

Maxim Integrated

IC USB SWITCH USB TYPE-C 25WLP

4420

LMH6572MQ

LMH6572MQ

VIDEO MULTIPLEXER, 3 FUNC, 2 CHA

0

Interface - Analog Switches - Special Purpose

1. Overview

Special Purpose Analog Switches are semiconductor devices designed to route analog signals in specialized applications where standard switches cannot meet specific performance requirements. These ICs use MOSFET-based structures to control signal paths with optimized parameters for voltage range, frequency response, and signal integrity. Their importance in modern electronics stems from enabling precise signal management in critical systems like medical imaging, industrial automation, and high-frequency communication equipment.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
High-Voltage SwitchesOperate at >20V, enhanced isolationPower supply switching in test equipment
High-Frequency SwitchesGHz-range operation, low capacitanceRF signal routing in 5G infrastructure
Precision SwitchesUltra-low leakage (pA range), minimal distortionMedical diagnostic equipment sensors
High-Current SwitchesHandles >1A continuous currentIndustrial motor control systems

3. Structure and Composition

Typical architecture includes:

  • CMOS/Trench MOSFET switching elements
  • Digital control logic with level shifting
  • ESD protection structures (TVS diodes)
  • Dielectrically isolated signal paths
  • Advanced packaging (QFN, TSSOP, BGA)

Specialized variants incorporate materials like gallium nitride (GaN) for high-power applications and silicon-on-insulator (SOI) for RF performance optimization.

4. Key Technical Specifications

ParameterDescriptionImportance
RON (On-Resistance)Resistance in conducting stateAffects signal attenuation and power loss
IOFF (Off-Leakage)Current in non-conducting stateDetermines signal isolation quality
BandwidthFrequency range of effective operationLimits maximum usable signal rate
Voltage RangeOperating voltage limitsDefines system compatibility
Switching SpeedTransition time between statesImpacts real-time control capabilities

5. Application Fields

  • Telecommunications: Optical transceiver signal routing
  • Medical Equipment: MRI scanner signal multiplexing
  • Industrial Automation: PLC analog signal switching
  • Test & Measurement: Automatic test equipment (ATE) matrix switches
  • Automotive: Battery management system signal control

6. Leading Manufacturers and Products

ManufacturerProduct FamilyKey Specifications
TI (Texas Instruments)TS5A231575V, 1 RON, 40MHz bandwidth
Analog DevicesADG541244V, 150 RON, -40 C to +125 C
NXP SemiconductorsPCA9546AI2C-controlled, 4-channel, 5.5V
Maxim IntegratedMAX4735High-current, 1A rating

7. Selection Guidelines

Key considerations include:

  • Signal voltage/current requirements
  • Operating environment (temperature, vibration)
  • Parasitic capacitance for high-speed applications
  • Package type vs. board space constraints
  • Control interface compatibility (GPIO, I2C, SPI)
  • Cost vs. reliability trade-offs

8. Industry Trends Analysis

Current development directions include:

  • Miniaturization: 0.4mm pitch WLCSP packaging
  • Integration: Switches with built-in diagnostic functions
  • Wide Bandgap Materials: GaN/SiC-based switches for power applications
  • Smart Switching: Embedded digital control algorithms
  • Energy Efficiency: Sub- A quiescent current designs

Market growth is driven by 5G infrastructure (25% CAGR in RF switches) and EV battery management systems requiring high-voltage switching.

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