Interface - Analog Switches - Special Purpose

Image Part Number Description / PDF Quantity Rfq
FSA203BQX

FSA203BQX

DPDT

50500

PI3DBS12212AXUAEX

PI3DBS12212AXUAEX

Zetex Semiconductors (Diodes Inc.)

IC MUX/DEMUX 12GBPS 18X2QFN

24480

HD3SS460RNHR

HD3SS460RNHR

Texas Instruments

IC MUX/DEMUX 4CH TYPE C2 30WQFN

0

ISL54206IRUZ-T

ISL54206IRUZ-T

Intersil (Renesas Electronics America)

SPDT, 1 CHANNEL, CMOS, PQCC10

8680

PEX8615-BA50BI G

PEX8615-BA50BI G

Broadcom

IC PCI EXPRESS SWITCH 324HSBGA

0

CBTL04083ABS,518

CBTL04083ABS,518

NXP Semiconductors

IC MUX/DEMUX 2:1 4CH 42HVQFN

3577

ISL54220IRTZ

ISL54220IRTZ

Intersil (Renesas Electronics America)

IC USB SWITCH DUAL SPDT 10TDFN

0

FSA2275UMX

FSA2275UMX

Sanyo Semiconductor/ON Semiconductor

IC SWITCH DUAL DPDT 12UMLP

1696

NLAS7222AMUR2G

NLAS7222AMUR2G

DPDT, 2 CHANNEL, CMOS

973

MAX4545CWP+

MAX4545CWP+

Maxim Integrated

IC VIDEO SWITCH QUAD SPST 20SOIC

223024

ISL54400IRZ

ISL54400IRZ

Intersil (Renesas Electronics America)

SPDT, 2 FUNC, 1 CHANNEL, CMOS

6722

FSUSB20BQX

FSUSB20BQX

SPDT, 2 FUNC, 1 CHANNEL, PQCC16

14957

PI3USB31532ZLCEX

PI3USB31532ZLCEX

Zetex Semiconductors (Diodes Inc.)

IC SWITCH USB3 W-QFN3060-40

6659

TSU6721YFPR

TSU6721YFPR

Texas Instruments

A HIGH PERFORMANCE USB

0

QS4A201QG8

QS4A201QG8

Renesas Electronics America

IC CROSSPOINT SWITCH 4X1 24QSOP

0

PI3WVR646GEEX

PI3WVR646GEEX

Zetex Semiconductors (Diodes Inc.)

ANALOG SWITCH 3V-5V U-WLB2424-36

2862

TS5USBC400YFPT

TS5USBC400YFPT

Texas Instruments

DUAL 2:1 USB 2.0 MUX/DEMUX OR SI

136

MAX4589EPP

MAX4589EPP

Analog Devices, Inc.

DUAL 2-CH RF/VIDEO MUX

0

MAX4983EEVB+T

MAX4983EEVB+T

Maxim Integrated

IC USB SWITCH DPDT 10UTQFN

3454

HV20220FG-G-M931

HV20220FG-G-M931

Roving Networks / Microchip Technology

IC ULTRASOUND SWITCH 1:1 48LQFP

0

Interface - Analog Switches - Special Purpose

1. Overview

Special Purpose Analog Switches are semiconductor devices designed to route analog signals in specialized applications where standard switches cannot meet specific performance requirements. These ICs use MOSFET-based structures to control signal paths with optimized parameters for voltage range, frequency response, and signal integrity. Their importance in modern electronics stems from enabling precise signal management in critical systems like medical imaging, industrial automation, and high-frequency communication equipment.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
High-Voltage SwitchesOperate at >20V, enhanced isolationPower supply switching in test equipment
High-Frequency SwitchesGHz-range operation, low capacitanceRF signal routing in 5G infrastructure
Precision SwitchesUltra-low leakage (pA range), minimal distortionMedical diagnostic equipment sensors
High-Current SwitchesHandles >1A continuous currentIndustrial motor control systems

3. Structure and Composition

Typical architecture includes:

  • CMOS/Trench MOSFET switching elements
  • Digital control logic with level shifting
  • ESD protection structures (TVS diodes)
  • Dielectrically isolated signal paths
  • Advanced packaging (QFN, TSSOP, BGA)

Specialized variants incorporate materials like gallium nitride (GaN) for high-power applications and silicon-on-insulator (SOI) for RF performance optimization.

4. Key Technical Specifications

ParameterDescriptionImportance
RON (On-Resistance)Resistance in conducting stateAffects signal attenuation and power loss
IOFF (Off-Leakage)Current in non-conducting stateDetermines signal isolation quality
BandwidthFrequency range of effective operationLimits maximum usable signal rate
Voltage RangeOperating voltage limitsDefines system compatibility
Switching SpeedTransition time between statesImpacts real-time control capabilities

5. Application Fields

  • Telecommunications: Optical transceiver signal routing
  • Medical Equipment: MRI scanner signal multiplexing
  • Industrial Automation: PLC analog signal switching
  • Test & Measurement: Automatic test equipment (ATE) matrix switches
  • Automotive: Battery management system signal control

6. Leading Manufacturers and Products

ManufacturerProduct FamilyKey Specifications
TI (Texas Instruments)TS5A231575V, 1 RON, 40MHz bandwidth
Analog DevicesADG541244V, 150 RON, -40 C to +125 C
NXP SemiconductorsPCA9546AI2C-controlled, 4-channel, 5.5V
Maxim IntegratedMAX4735High-current, 1A rating

7. Selection Guidelines

Key considerations include:

  • Signal voltage/current requirements
  • Operating environment (temperature, vibration)
  • Parasitic capacitance for high-speed applications
  • Package type vs. board space constraints
  • Control interface compatibility (GPIO, I2C, SPI)
  • Cost vs. reliability trade-offs

8. Industry Trends Analysis

Current development directions include:

  • Miniaturization: 0.4mm pitch WLCSP packaging
  • Integration: Switches with built-in diagnostic functions
  • Wide Bandgap Materials: GaN/SiC-based switches for power applications
  • Smart Switching: Embedded digital control algorithms
  • Energy Efficiency: Sub- A quiescent current designs

Market growth is driven by 5G infrastructure (25% CAGR in RF switches) and EV battery management systems requiring high-voltage switching.

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