Board Spacers, Standoffs

Image Part Number Description / PDF Quantity Rfq
R30-3003502

R30-3003502

Harwin

HEX STANDOFF M3X0.5 BRASS 35MM

2997

R30-1001202

R30-1001202

Harwin

HEX STANDOFF M3X0.5 BRASS 12MM

2565

R25-1001602

R25-1001602

Harwin

HEX STNDFF M2.5X0.45 BRASS 16MM

4519

R40-3001202

R40-3001202

Harwin

HEX STANDOFF M4X0.7 BRASS 12MM

3428

R40-3001602

R40-3001602

Harwin

HEX STANDOFF M4X0.7 BRASS 16MM

457

R25-3001602

R25-3001602

Harwin

HEX STNDFF M2.5X0.45 BRASS 16MM

0

R30-1611100

R30-1611100

Harwin

HEX STANDOFF M3X0.5 NYLON 11MM

3384

R40-3001002

R40-3001002

Harwin

HEX STANDOFF M4X0.7 BRASS 10MM

0

R30-9400300

R30-9400300

Harwin

HEX SPACER M3 PLASTIC 3MM

0

R30-6701894

R30-6701894

Harwin

ROUND SPACER M3 NYLON 18MM

1099

R30-1002002

R30-1002002

Harwin

HEX STANDOFF M3X0.5 BRASS 20MM

4361

R40-1000802

R40-1000802

Harwin

HEX STANDOFF M4X0.7 BRASS 8MM

2493

R30-6201014

R30-6201014

Harwin

ROUND SPACER M3 ALUMINUM 10MM

0

R30-6200414

R30-6200414

Harwin

ROUND SPACER M3 ALUMINUM 4MM

2831

R30-3002002

R30-3002002

Harwin

HEX STANDOFF M3X0.5 BRASS 20MM

387

R30-3002402

R30-3002402

Harwin

HEX STANDOFF M3X0.5 BRASS 24MM

10924

R30-1002802

R30-1002802

Harwin

HEX STANDOFF M3X0.5 BRASS 28MM

0

R30-1000902

R30-1000902

Harwin

HEX STANDOFF M3X0.5 BRASS 9MM

91

R40-1002002

R40-1002002

Harwin

HEX STANDOFF M4X0.7 BRASS 20MM

1298

R30-3010802

R30-3010802

Harwin

HEX STANDOFF M3X0.5 BRASS 8MM

716

Board Spacers, Standoffs

1. Overview

Board spacers and standoffs are specialized hardware components used to create controlled spacing between printed circuit boards (PCBs), panels, or structural elements. They provide mechanical support, electrical isolation, and thermal management in electronic assemblies. Their importance in modern technology includes enabling compact designs, reducing vibration stress, and improving heat dissipation in devices ranging from smartphones to industrial control systems.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Cylindrical SpacersSimple tubular design with uniform diameterPCB layer separation in consumer electronics
Hexagonal Standoffs6-sided structure for wrench tighteningIndustrial equipment panel mounting
Self-clinching StandoffsPermanent installation with threaded compressionSheet metal enclosures in servers
Adjustable SpacersVariable length through threaded adjustmentPrototype development and testing
Insulated SpacersNon-conductive materials for electrical isolationHigh-voltage power supply assemblies

3. Structure & Composition

Typical construction includes:

  • Material: Stainless steel (corrosion resistance), aluminum (lightweight), or nylon (insulation)
  • Geometry: Cylindrical (standard), stepped (for multiple board heights), or flanged (for load distribution)
  • Installation Features: Internal threading (male/female), knurled surfaces (for grip), or press-fit tabs
  • Surface Treatment: Passivation (metal), UV resistance (plastics), or EMI shielding coating

4. Key Technical Specifications

ParameterImportance
Material Hardness (HV)Determines wear resistance and load capacity
Thread Engagement LengthAffects vibration resistance in dynamic environments
Thermal Conductivity (W/m K)Critical for heat dissipation in power electronics
Dielectric Strength (kV/mm)Safety factor in high-voltage applications
Installation Torque RatingPrevents over-tightening damage to PCBs

5. Application Fields

Primary industries include:

  • Electronics Manufacturing: Server racks, LED displays
  • Automotive: Engine control units (ECUs), ADAS systems
  • Aerospace: Satellite PCB mounting, avionics enclosures
  • Medical Devices: MRI scanner internal structures
  • Consumer Electronics: Smartphone PCB stacking

6. Leading Manufacturers & Products

ManufacturerRepresentative Product
PEMS-8900 Series self-clinching standoffs
RS Components486-8826 insulated hexagonal spacers
Mouser Electronics925206-12 adjustable PCB spacers
McMaster-Carr91285A102 stainless steel standoffs

7. Selection Recommendations

  • Evaluate mechanical load requirements vs material strength
  • Match thread type (UNC/UNF/Metric) with assembly hardware
  • Consider CTE (Coefficient of Thermal Expansion) compatibility with PCB materials
  • Select insulated variants for >50V circuits
  • Use vibration-damping coatings in mobile applications

8. Industry Trends

Emerging developments include:

  • Miniaturization: Sub-1mm spacers for wearable devices
  • Material Innovation: Conductive polymer composites for EMI shielding
  • Smart Integration: Standoffs with embedded strain gauges for structural monitoring
  • Automated Installation: Self-aligning designs for robotic assembly lines
  • Sustainability: Biodegradable plastic options (PLA-based) entering mainstream production
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