Board Spacers, Standoffs

Image Part Number Description / PDF Quantity Rfq
R30-1012502

R30-1012502

Harwin

HEX STANDOFF M3X0.5 BRASS 25MM

281

R30-6010402

R30-6010402

Harwin

ROUND SPACER M3 BRASS 4MM

4574

R30-1011502

R30-1011502

Harwin

HEX STANDOFF M3X0.5 BRASS 15MM

3990

R30-1011002

R30-1011002

Harwin

HEX STANDOFF M3X0.5 BRASS 10MM

4376

R30-3001002

R30-3001002

Harwin

HEX STANDOFF M3X0.5 BRASS 10MM

9548

R30-1000502

R30-1000502

Harwin

HEX STANDOFF M3X0.5 BRASS 5MM

0

R30-1611600

R30-1611600

Harwin

HEX STANDOFF M3X0.5 NYLON 16MM

1456

R40-6710594

R40-6710594

Harwin

ROUND SPACER M4 NYLON 5MM

3457

R30-6701094

R30-6701094

Harwin

ROUND SPACER M3 NYLON 10MM

3157

R40-3001502

R40-3001502

Harwin

HEX STANDOFF M4X0.7 BRASS 15MM

700

R30-9400500

R30-9400500

Harwin

HEX SPACER M3 PLASTIC 5MM

1175

R30-1612000

R30-1612000

Harwin

HEX STANDOFF M3X0.5 NYLON 20MM

2124

R30-3000702

R30-3000702

Harwin

HEX STANDOFF M3X0.5 BRASS 7MM

0

R30-6701694

R30-6701694

Harwin

ROUND SPACER M3 NYLON 16MM

1508

R30-1011402

R30-1011402

Harwin

HEX STANDOFF M3X0.5 BRASS 14MM

1211

R30-1001302

R30-1001302

Harwin

HEX STANDOFF M3X0.5 BRASS 13MM

53

R30-5001602

R30-5001602

Harwin

ROUND STANDOFF M3X0.5 BRASS 16MM

0

R30-5001402

R30-5001402

Harwin

ROUND STANDOFF M3X0.5 BRASS 14MM

654

R30-6200814

R30-6200814

Harwin

ROUND SPACER M3 ALUMINUM 8MM

2179

R30-1610600

R30-1610600

Harwin

HEX STANDOFF M3X0.5 NYLON 6MM

2218

Board Spacers, Standoffs

1. Overview

Board spacers and standoffs are specialized hardware components used to create controlled spacing between printed circuit boards (PCBs), panels, or structural elements. They provide mechanical support, electrical isolation, and thermal management in electronic assemblies. Their importance in modern technology includes enabling compact designs, reducing vibration stress, and improving heat dissipation in devices ranging from smartphones to industrial control systems.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Cylindrical SpacersSimple tubular design with uniform diameterPCB layer separation in consumer electronics
Hexagonal Standoffs6-sided structure for wrench tighteningIndustrial equipment panel mounting
Self-clinching StandoffsPermanent installation with threaded compressionSheet metal enclosures in servers
Adjustable SpacersVariable length through threaded adjustmentPrototype development and testing
Insulated SpacersNon-conductive materials for electrical isolationHigh-voltage power supply assemblies

3. Structure & Composition

Typical construction includes:

  • Material: Stainless steel (corrosion resistance), aluminum (lightweight), or nylon (insulation)
  • Geometry: Cylindrical (standard), stepped (for multiple board heights), or flanged (for load distribution)
  • Installation Features: Internal threading (male/female), knurled surfaces (for grip), or press-fit tabs
  • Surface Treatment: Passivation (metal), UV resistance (plastics), or EMI shielding coating

4. Key Technical Specifications

ParameterImportance
Material Hardness (HV)Determines wear resistance and load capacity
Thread Engagement LengthAffects vibration resistance in dynamic environments
Thermal Conductivity (W/m K)Critical for heat dissipation in power electronics
Dielectric Strength (kV/mm)Safety factor in high-voltage applications
Installation Torque RatingPrevents over-tightening damage to PCBs

5. Application Fields

Primary industries include:

  • Electronics Manufacturing: Server racks, LED displays
  • Automotive: Engine control units (ECUs), ADAS systems
  • Aerospace: Satellite PCB mounting, avionics enclosures
  • Medical Devices: MRI scanner internal structures
  • Consumer Electronics: Smartphone PCB stacking

6. Leading Manufacturers & Products

ManufacturerRepresentative Product
PEMS-8900 Series self-clinching standoffs
RS Components486-8826 insulated hexagonal spacers
Mouser Electronics925206-12 adjustable PCB spacers
McMaster-Carr91285A102 stainless steel standoffs

7. Selection Recommendations

  • Evaluate mechanical load requirements vs material strength
  • Match thread type (UNC/UNF/Metric) with assembly hardware
  • Consider CTE (Coefficient of Thermal Expansion) compatibility with PCB materials
  • Select insulated variants for >50V circuits
  • Use vibration-damping coatings in mobile applications

8. Industry Trends

Emerging developments include:

  • Miniaturization: Sub-1mm spacers for wearable devices
  • Material Innovation: Conductive polymer composites for EMI shielding
  • Smart Integration: Standoffs with embedded strain gauges for structural monitoring
  • Automated Installation: Self-aligning designs for robotic assembly lines
  • Sustainability: Biodegradable plastic options (PLA-based) entering mainstream production
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