Board Spacers, Standoffs

Image Part Number Description / PDF Quantity Rfq
R6397-02

R6397-02

Harwin

HEX STANDOFF M3X0.5 BRASS 1"

1418

R30-6700994

R30-6700994

Harwin

ROUND SPACER M3 NYLON 9MM

0

R30-3001302

R30-3001302

Harwin

HEX STANDOFF M3X0.5 BRASS 13MM

5727

R30-6010502

R30-6010502

Harwin

ROUND SPACER M3 BRASS 5MM

1955

R30-6700894

R30-6700894

Harwin

ROUND SPACER M3 NYLON 8MM

7964

R30-1010702

R30-1010702

Harwin

HEX STANDOFF M3X0.5 BRASS 7MM

1175

R40-6710394

R40-6710394

Harwin

ROUND SPACER M4 NYLON 3MM

0

R30-6011202

R30-6011202

Harwin

ROUND SPACER M3 BRASS 12MM

746

R30-6010302

R30-6010302

Harwin

ROUND SPACER M3 BRASS 3MM

16450

R30-1011302

R30-1011302

Harwin

HEX STANDOFF M3X0.5 BRASS 13MM

1467

R40-3001802

R40-3001802

Harwin

HEX STANDOFF M4X0.7 BRASS 18MM

5169

R40-3000902

R40-3000902

Harwin

HEX STANDOFF M4X0.7 BRASS 9MM

0

R30-3011502

R30-3011502

Harwin

HEX STANDOFF M3X0.5 BRASS 15MM

1194

R30-9402500

R30-9402500

Harwin

HEX SPACER M3 PLASTIC 25MM

0

R40-1001302

R40-1001302

Harwin

HEX STANDOFF M4X0.7 BRASS 13MM

0

R30-3011002

R30-3011002

Harwin

HEX STANDOFF M3X0.5 BRASS 10MM

1105

R30-3001602

R30-3001602

Harwin

HEX STANDOFF M3X0.5 BRASS 16MM

2776

R30-5001102

R30-5001102

Harwin

ROUND STANDOFF M3X0.5 BRASS 11MM

7401

R30-6012202

R30-6012202

Harwin

ROUND SPACER M3 BRASS 22MM

595

R30-4000402

R30-4000402

Harwin

HEX STANDOFF M3X0.5 BRASS 4MM

6621

Board Spacers, Standoffs

1. Overview

Board spacers and standoffs are specialized hardware components used to create controlled spacing between printed circuit boards (PCBs), panels, or structural elements. They provide mechanical support, electrical isolation, and thermal management in electronic assemblies. Their importance in modern technology includes enabling compact designs, reducing vibration stress, and improving heat dissipation in devices ranging from smartphones to industrial control systems.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Cylindrical SpacersSimple tubular design with uniform diameterPCB layer separation in consumer electronics
Hexagonal Standoffs6-sided structure for wrench tighteningIndustrial equipment panel mounting
Self-clinching StandoffsPermanent installation with threaded compressionSheet metal enclosures in servers
Adjustable SpacersVariable length through threaded adjustmentPrototype development and testing
Insulated SpacersNon-conductive materials for electrical isolationHigh-voltage power supply assemblies

3. Structure & Composition

Typical construction includes:

  • Material: Stainless steel (corrosion resistance), aluminum (lightweight), or nylon (insulation)
  • Geometry: Cylindrical (standard), stepped (for multiple board heights), or flanged (for load distribution)
  • Installation Features: Internal threading (male/female), knurled surfaces (for grip), or press-fit tabs
  • Surface Treatment: Passivation (metal), UV resistance (plastics), or EMI shielding coating

4. Key Technical Specifications

ParameterImportance
Material Hardness (HV)Determines wear resistance and load capacity
Thread Engagement LengthAffects vibration resistance in dynamic environments
Thermal Conductivity (W/m K)Critical for heat dissipation in power electronics
Dielectric Strength (kV/mm)Safety factor in high-voltage applications
Installation Torque RatingPrevents over-tightening damage to PCBs

5. Application Fields

Primary industries include:

  • Electronics Manufacturing: Server racks, LED displays
  • Automotive: Engine control units (ECUs), ADAS systems
  • Aerospace: Satellite PCB mounting, avionics enclosures
  • Medical Devices: MRI scanner internal structures
  • Consumer Electronics: Smartphone PCB stacking

6. Leading Manufacturers & Products

ManufacturerRepresentative Product
PEMS-8900 Series self-clinching standoffs
RS Components486-8826 insulated hexagonal spacers
Mouser Electronics925206-12 adjustable PCB spacers
McMaster-Carr91285A102 stainless steel standoffs

7. Selection Recommendations

  • Evaluate mechanical load requirements vs material strength
  • Match thread type (UNC/UNF/Metric) with assembly hardware
  • Consider CTE (Coefficient of Thermal Expansion) compatibility with PCB materials
  • Select insulated variants for >50V circuits
  • Use vibration-damping coatings in mobile applications

8. Industry Trends

Emerging developments include:

  • Miniaturization: Sub-1mm spacers for wearable devices
  • Material Innovation: Conductive polymer composites for EMI shielding
  • Smart Integration: Standoffs with embedded strain gauges for structural monitoring
  • Automated Installation: Self-aligning designs for robotic assembly lines
  • Sustainability: Biodegradable plastic options (PLA-based) entering mainstream production
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