Board Spacers, Standoffs

Image Part Number Description / PDF Quantity Rfq
R30-3000902

R30-3000902

Harwin

HEX STANDOFF M3X0.5 BRASS 9MM

1764

R30-1011102

R30-1011102

Harwin

HEX STANDOFF M3X0.5 BRASS 11MM

4223

R30-6011002

R30-6011002

Harwin

ROUND SPACER M3 BRASS 10MM

1534

R30-6010202

R30-6010202

Harwin

ROUND SPACER M3 BRASS 2MM

3802

R30-6010702

R30-6010702

Harwin

ROUND SPACER M3 BRASS 7MM

455

R30-3001402

R30-3001402

Harwin

HEX STANDOFF M3X0.5 BRASS 14MM

0

R30-3002202

R30-3002202

Harwin

HEX STANDOFF M3X0.5 BRASS 22MM

675

R30-9400600

R30-9400600

Harwin

HEX SPACER M3 PLASTIC 6MM

0

R30-6200314

R30-6200314

Harwin

ROUND SPACER M3 ALUMINUM 3MM

0

R30-6011802

R30-6011802

Harwin

ROUND SPACER M3 BRASS 18MM

0

R30-3000502

R30-3000502

Harwin

HEX STANDOFF M3X0.5 BRASS 5MM

4285

R30-9401800

R30-9401800

Harwin

HEX SPACER M3 PLASTIC 18MM

0

R30-4000502

R30-4000502

Harwin

HEX STANDOFF M3X0.5 BRASS 5MM

2019

R30-6700394

R30-6700394

Harwin

ROUND SPACER M3 NYLON 3MM

13

R30-1001102

R30-1001102

Harwin

HEX STANDOFF M3X0.5 BRASS 11MM

5396

R30-9401000

R30-9401000

Harwin

HEX SPACER PLASTIC 10MM

1528

R30-6200514

R30-6200514

Harwin

ROUND SPACER M3 ALUMINUM 5MM

5916

R30-5000702

R30-5000702

Harwin

ROUND STANDOFF M3X0.5 BRASS 7MM

888

R44-1001002

R44-1001002

Harwin

HEX STANDOFF #4-40 BRASS 10MM

1345

R30-6701394

R30-6701394

Harwin

ROUND SPACER M3 NYLON 13MM

2148

Board Spacers, Standoffs

1. Overview

Board spacers and standoffs are specialized hardware components used to create controlled spacing between printed circuit boards (PCBs), panels, or structural elements. They provide mechanical support, electrical isolation, and thermal management in electronic assemblies. Their importance in modern technology includes enabling compact designs, reducing vibration stress, and improving heat dissipation in devices ranging from smartphones to industrial control systems.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Cylindrical SpacersSimple tubular design with uniform diameterPCB layer separation in consumer electronics
Hexagonal Standoffs6-sided structure for wrench tighteningIndustrial equipment panel mounting
Self-clinching StandoffsPermanent installation with threaded compressionSheet metal enclosures in servers
Adjustable SpacersVariable length through threaded adjustmentPrototype development and testing
Insulated SpacersNon-conductive materials for electrical isolationHigh-voltage power supply assemblies

3. Structure & Composition

Typical construction includes:

  • Material: Stainless steel (corrosion resistance), aluminum (lightweight), or nylon (insulation)
  • Geometry: Cylindrical (standard), stepped (for multiple board heights), or flanged (for load distribution)
  • Installation Features: Internal threading (male/female), knurled surfaces (for grip), or press-fit tabs
  • Surface Treatment: Passivation (metal), UV resistance (plastics), or EMI shielding coating

4. Key Technical Specifications

ParameterImportance
Material Hardness (HV)Determines wear resistance and load capacity
Thread Engagement LengthAffects vibration resistance in dynamic environments
Thermal Conductivity (W/m K)Critical for heat dissipation in power electronics
Dielectric Strength (kV/mm)Safety factor in high-voltage applications
Installation Torque RatingPrevents over-tightening damage to PCBs

5. Application Fields

Primary industries include:

  • Electronics Manufacturing: Server racks, LED displays
  • Automotive: Engine control units (ECUs), ADAS systems
  • Aerospace: Satellite PCB mounting, avionics enclosures
  • Medical Devices: MRI scanner internal structures
  • Consumer Electronics: Smartphone PCB stacking

6. Leading Manufacturers & Products

ManufacturerRepresentative Product
PEMS-8900 Series self-clinching standoffs
RS Components486-8826 insulated hexagonal spacers
Mouser Electronics925206-12 adjustable PCB spacers
McMaster-Carr91285A102 stainless steel standoffs

7. Selection Recommendations

  • Evaluate mechanical load requirements vs material strength
  • Match thread type (UNC/UNF/Metric) with assembly hardware
  • Consider CTE (Coefficient of Thermal Expansion) compatibility with PCB materials
  • Select insulated variants for >50V circuits
  • Use vibration-damping coatings in mobile applications

8. Industry Trends

Emerging developments include:

  • Miniaturization: Sub-1mm spacers for wearable devices
  • Material Innovation: Conductive polymer composites for EMI shielding
  • Smart Integration: Standoffs with embedded strain gauges for structural monitoring
  • Automated Installation: Self-aligning designs for robotic assembly lines
  • Sustainability: Biodegradable plastic options (PLA-based) entering mainstream production
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