Board Spacers, Standoffs

Image Part Number Description / PDF Quantity Rfq
R30-6011302

R30-6011302

Harwin

ROUND SPACER M3 BRASS 13MM

0

R30-5000802

R30-5000802

Harwin

ROUND STANDOFF M3X0.5 BRASS 8MM

88

R25-1001202

R25-1001202

Harwin

HEX STNDFF M2.5X0.45 BRASS 12MM

1386

R30-6200914

R30-6200914

Harwin

ROUND SPACER M3 ALUMINUM 9MM

0

R30-1011602

R30-1011602

Harwin

HEX STANDOFF M3X0.5 BRASS 16MM

241

R30-5002002

R30-5002002

Harwin

ROUND STANDOFF M3X0.5 BRASS 20MM

9346

R30-1611500

R30-1611500

Harwin

HEX STANDOFF M3X0.5 NYLON 15MM

438

R6104-02

R6104-02

Harwin

HEX STNDFF M3X0.5 BRASS 15.24MM

4773

R30-1010402

R30-1010402

Harwin

HEX STANDOFF M3X0.5 BRASS 4MM

4400

R30-1010802

R30-1010802

Harwin

HEX STANDOFF M3X0.5 BRASS 8MM

8711

R30-6201314

R30-6201314

Harwin

ROUND SPACER M3 ALUMINUM 13MM

9885

R30-1001502

R30-1001502

Harwin

HEX STANDOFF M3X0.5 BRASS 15MM

845

R30-1611300

R30-1611300

Harwin

HEX STANDOFF M3X0.5 NYLON 13MM

3310

R30-6700594

R30-6700594

Harwin

ROUND SPACER M3 NYLON 5MM

17518

R40-3003502

R40-3003502

Harwin

HEX STANDOFF M4X0.7 BRASS 35MM

0

R30-5000902

R30-5000902

Harwin

ROUND STANDOFF M3X0.5 BRASS 9MM

0

R25-1001402

R25-1001402

Harwin

HEX STNDFF M2.5X0.45 BRASS 14MM

1649

R30-6011602

R30-6011602

Harwin

ROUND SPACER M3 BRASS 16MM

1414

R30-3001502

R30-3001502

Harwin

HEX STANDOFF M3X0.5 BRASS 15MM

5763

R30-1011202

R30-1011202

Harwin

HEX STANDOFF M3X0.5 BRASS 12MM

214

Board Spacers, Standoffs

1. Overview

Board spacers and standoffs are specialized hardware components used to create controlled spacing between printed circuit boards (PCBs), panels, or structural elements. They provide mechanical support, electrical isolation, and thermal management in electronic assemblies. Their importance in modern technology includes enabling compact designs, reducing vibration stress, and improving heat dissipation in devices ranging from smartphones to industrial control systems.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Cylindrical SpacersSimple tubular design with uniform diameterPCB layer separation in consumer electronics
Hexagonal Standoffs6-sided structure for wrench tighteningIndustrial equipment panel mounting
Self-clinching StandoffsPermanent installation with threaded compressionSheet metal enclosures in servers
Adjustable SpacersVariable length through threaded adjustmentPrototype development and testing
Insulated SpacersNon-conductive materials for electrical isolationHigh-voltage power supply assemblies

3. Structure & Composition

Typical construction includes:

  • Material: Stainless steel (corrosion resistance), aluminum (lightweight), or nylon (insulation)
  • Geometry: Cylindrical (standard), stepped (for multiple board heights), or flanged (for load distribution)
  • Installation Features: Internal threading (male/female), knurled surfaces (for grip), or press-fit tabs
  • Surface Treatment: Passivation (metal), UV resistance (plastics), or EMI shielding coating

4. Key Technical Specifications

ParameterImportance
Material Hardness (HV)Determines wear resistance and load capacity
Thread Engagement LengthAffects vibration resistance in dynamic environments
Thermal Conductivity (W/m K)Critical for heat dissipation in power electronics
Dielectric Strength (kV/mm)Safety factor in high-voltage applications
Installation Torque RatingPrevents over-tightening damage to PCBs

5. Application Fields

Primary industries include:

  • Electronics Manufacturing: Server racks, LED displays
  • Automotive: Engine control units (ECUs), ADAS systems
  • Aerospace: Satellite PCB mounting, avionics enclosures
  • Medical Devices: MRI scanner internal structures
  • Consumer Electronics: Smartphone PCB stacking

6. Leading Manufacturers & Products

ManufacturerRepresentative Product
PEMS-8900 Series self-clinching standoffs
RS Components486-8826 insulated hexagonal spacers
Mouser Electronics925206-12 adjustable PCB spacers
McMaster-Carr91285A102 stainless steel standoffs

7. Selection Recommendations

  • Evaluate mechanical load requirements vs material strength
  • Match thread type (UNC/UNF/Metric) with assembly hardware
  • Consider CTE (Coefficient of Thermal Expansion) compatibility with PCB materials
  • Select insulated variants for >50V circuits
  • Use vibration-damping coatings in mobile applications

8. Industry Trends

Emerging developments include:

  • Miniaturization: Sub-1mm spacers for wearable devices
  • Material Innovation: Conductive polymer composites for EMI shielding
  • Smart Integration: Standoffs with embedded strain gauges for structural monitoring
  • Automated Installation: Self-aligning designs for robotic assembly lines
  • Sustainability: Biodegradable plastic options (PLA-based) entering mainstream production
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