Board Spacers, Standoffs

Image Part Number Description / PDF Quantity Rfq
R6395-02

R6395-02

Harwin

HEX STANDOFF M3X0.5 BRASS 19MM

3161

R40-6000502

R40-6000502

Harwin

ROUND SPACER M4 BRASS 5MM

2663

R40-3001102

R40-3001102

Harwin

HEX STANDOFF M4X0.7 BRASS 11MM

0

R40-1003002

R40-1003002

Harwin

HEX STANDOFF M4X0.7 BRASS 30MM

361

R30-6010802

R30-6010802

Harwin

ROUND SPACER M3 BRASS 8MM

602

R30-9400800

R30-9400800

Harwin

HEX SPACER M3 PLASTIC 8MM

7065

R40-6711294

R40-6711294

Harwin

ROUND SPACER M4 NYLON 12MM

4534

R40-1001402

R40-1001402

Harwin

HEX STANDOFF M4X0.7 BRASS 14MM

5219

R30-6200614

R30-6200614

Harwin

ROUND SPACER M3 ALUMINUM 6MM

4857

R6396-02

R6396-02

Harwin

HEX STANDOFF M3X0.5 BRASS 7/8"

1089

R40-1001202

R40-1001202

Harwin

HEX STANDOFF M4X0.7 BRASS 12MM

0

R40-6710894

R40-6710894

Harwin

ROUND SPACER M4 NYLON 8MM

3304

R30-3001202

R30-3001202

Harwin

HEX STANDOFF M3X0.5 BRASS 12MM

10172

R30-6700794

R30-6700794

Harwin

ROUND SPACER M3 NYLON 7MM

2583

R30-1000602

R30-1000602

Harwin

HEX STANDOFF M3X0.5 BRASS 6MM

4711

R30-1000802

R30-1000802

Harwin

HEX STANDOFF M3X0.5 BRASS 8MM

5056

R30-3001802

R30-3001802

Harwin

HEX STANDOFF M3X0.5 BRASS 18MM

1740

R30-6701594

R30-6701594

Harwin

ROUND SPACER M3 NYLON 15MM

642

R30-6200714

R30-6200714

Harwin

ROUND SPACER M3 ALUMINUM 7MM

1548

R30-5000402

R30-5000402

Harwin

ROUND STANDOFF M3X0.5 BRASS 4MM

336

Board Spacers, Standoffs

1. Overview

Board spacers and standoffs are specialized hardware components used to create controlled spacing between printed circuit boards (PCBs), panels, or structural elements. They provide mechanical support, electrical isolation, and thermal management in electronic assemblies. Their importance in modern technology includes enabling compact designs, reducing vibration stress, and improving heat dissipation in devices ranging from smartphones to industrial control systems.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Cylindrical SpacersSimple tubular design with uniform diameterPCB layer separation in consumer electronics
Hexagonal Standoffs6-sided structure for wrench tighteningIndustrial equipment panel mounting
Self-clinching StandoffsPermanent installation with threaded compressionSheet metal enclosures in servers
Adjustable SpacersVariable length through threaded adjustmentPrototype development and testing
Insulated SpacersNon-conductive materials for electrical isolationHigh-voltage power supply assemblies

3. Structure & Composition

Typical construction includes:

  • Material: Stainless steel (corrosion resistance), aluminum (lightweight), or nylon (insulation)
  • Geometry: Cylindrical (standard), stepped (for multiple board heights), or flanged (for load distribution)
  • Installation Features: Internal threading (male/female), knurled surfaces (for grip), or press-fit tabs
  • Surface Treatment: Passivation (metal), UV resistance (plastics), or EMI shielding coating

4. Key Technical Specifications

ParameterImportance
Material Hardness (HV)Determines wear resistance and load capacity
Thread Engagement LengthAffects vibration resistance in dynamic environments
Thermal Conductivity (W/m K)Critical for heat dissipation in power electronics
Dielectric Strength (kV/mm)Safety factor in high-voltage applications
Installation Torque RatingPrevents over-tightening damage to PCBs

5. Application Fields

Primary industries include:

  • Electronics Manufacturing: Server racks, LED displays
  • Automotive: Engine control units (ECUs), ADAS systems
  • Aerospace: Satellite PCB mounting, avionics enclosures
  • Medical Devices: MRI scanner internal structures
  • Consumer Electronics: Smartphone PCB stacking

6. Leading Manufacturers & Products

ManufacturerRepresentative Product
PEMS-8900 Series self-clinching standoffs
RS Components486-8826 insulated hexagonal spacers
Mouser Electronics925206-12 adjustable PCB spacers
McMaster-Carr91285A102 stainless steel standoffs

7. Selection Recommendations

  • Evaluate mechanical load requirements vs material strength
  • Match thread type (UNC/UNF/Metric) with assembly hardware
  • Consider CTE (Coefficient of Thermal Expansion) compatibility with PCB materials
  • Select insulated variants for >50V circuits
  • Use vibration-damping coatings in mobile applications

8. Industry Trends

Emerging developments include:

  • Miniaturization: Sub-1mm spacers for wearable devices
  • Material Innovation: Conductive polymer composites for EMI shielding
  • Smart Integration: Standoffs with embedded strain gauges for structural monitoring
  • Automated Installation: Self-aligning designs for robotic assembly lines
  • Sustainability: Biodegradable plastic options (PLA-based) entering mainstream production
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