Ferrite Beads and Chips

Part Number	Description / PDF	Quantity
MPZ0402S220CTF0W TDK Corporation	FERRITE BEAD 22 OHM 01005 1LN	78780
MMZ2012R121ATD25 TDK Corporation	FERRITE BEAD 120 OHM 0805 1LN	10195
MAF1005GAD401DT000 TDK Corporation	NOISE SUPPRESSION FILTER FOR AUD	6739
MMZ0603F750ET000 TDK Corporation	FERRITE BEAD 75 OHM 0201 1LN	13320
MPZ0603S330HT000 TDK Corporation	CHIP BEADS FOR GENERAL SIGNAL LI	27162
MMZ0603S601HT000 TDK Corporation	FERRITE BEAD 600 OHM 0201 1LN	143823
KMZ1608YHR600BTD25 TDK Corporation	FERRITE BEAD 60 OHM 0603 1LN	6335
MPZ1005D330ETD25 TDK Corporation	CHIP BEADS FOR POWER LINE, FOR A	8933
MAF1005GWZ102AT000 TDK Corporation	NOISE SUPPRESSION FILTER FOR AUD	18570
MPZ1608Y101BTA00 TDK Corporation	FERRITE BEAD 100 OHM 0603 1LN	3148
MMZ2012Y600BTD25 TDK Corporation	FERRITE BEAD 60 OHM 0805 1LN	3803
HF30ACC321611-TD25 TDK Corporation	FERRITE BEAD 19 OHM 1206 1LN	600
HF70ACC322513-TD25 TDK Corporation	FERRITE BEAD 52 OHM 1210 1LN	3484
KMZ1608SHR601ATD25 TDK Corporation	FERRITE BEAD 600 OHM 0603 1LN	2702
MMZ1005D330CTD25 TDK Corporation	FERRITE BEAD 33 OHM 0402 1LN	2361
MMZ0603D470ET000 TDK Corporation	FERRITE BEAD 47 OHM 0201 1LN	7884
MMZ1005F121ET000 TDK Corporation	FERRITE BEAD 120 OHM 0402 1LN	2414
MPZ0603S220CT000 TDK Corporation	FERRITE BEAD 22 OHM 0201 1LN	18147
VFS6045VA031 TDK Corporation	NOISE SUPPRESSION FILTER FOR HOM	2988
MMZ0402S121CT000 TDK Corporation	FERRITE BEAD 120 OHM 01005 1LN	22692

Ferrite Beads and Chips

1. Overview

Ferrite beads and chips are passive electronic components designed to suppress high-frequency noise in electrical circuits. Made from ferrite materials (iron oxide compounds), they act as low-pass filters by dissipating electromagnetic interference (EMI) as heat. Their importance in modern electronics lies in ensuring signal integrity, reducing radio-frequency interference (RFI), and complying with electromagnetic compatibility (EMC) standards. They are widely used in power supplies, communication systems, and high-speed digital circuits.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
High-Frequency Ferrite Beads	Optimized for GHz-range noise suppression, low core loss	5G transceivers, RF modules
Low-Frequency Ferrite Beads	Effective at MHz-range filtering, high impedance stability	Power supplies, motor drives
High-Current Chips	Designed for >1A applications, thermal stability	EV battery management systems
Multilayer Ferrite Chips	Stacked structure for broadband filtering	Smartphones, IoT devices

3. Structure and Composition

Typical construction includes:

Ferrite Core: Mn-Zn or Ni-Zn based ceramic material
Electrodes: Silver-palladium (AgPd) or copper-nickel (CuNi) terminations
Encapsulation: Epoxy or polymer coating for mechanical protection
Geometry: Available in cylindrical (beads) or rectangular (chips) formats

Advanced designs incorporate internal electrode layers to increase impedance density.

4. Key Technical Parameters

Parameter	Description	Importance
Impedance (Z)	100MHz @ 100 -10k	Determines noise suppression efficiency
Rated Current	100mA-10A	Affects circuit stability under load
Frequency Range	1MHz-10GHz	Defines operational bandwidth
DC Resistance (DCR)	0.1 -20	Impacts power loss and heating
Operating Temp.	-55 C to +150 C	Ensures reliability in extreme conditions

5. Application Areas

Consumer Electronics: Smartphones (camera module filtering), laptops (power line conditioning)
Automotive: EV charging systems (CAN bus noise suppression), ADAS sensors
Industrial: PLCs (programmable logic controllers), motor drives
Telecom: Base stations (RF front-end filtering), optical transceivers

6. Leading Manufacturers and Products

Manufacturer	Key Products	Specifications
Murata	BLSH series	0.7A, 600 @ 100MHz, EIA 0603
TDK	MMZ series	3.0A, 2200 @ 100MHz, EIA 1210
Coilcraft	0603LS series	1.5A, 500 @ 100MHz, 0.65mm height
W rth Elektronik	744300 series	2.0A, 1500 @ 100MHz, AEC-Q200 qualified

7. Selection Guidelines

Define frequency range: Choose Ni-Zn for >100MHz applications, Mn-Zn for low frequencies
Calculate current requirements: Select rated current 20% higher than maximum operating current
Impedance matching: Ensure Z 10 source/load impedance at target frequency
Package constraints: Prioritize chip format for space-limited PCB designs
Environmental factors: Consider temperature rating for automotive/industrial applications
Cost optimization: Balance performance needs with standard vs. high-end part pricing

8. Industry Trends

Key development directions include:

Miniaturization: Development of 0201/01005 chip sizes for wearable devices
High-frequency performance: Materials enabling stable operation beyond 10GHz
Integrated solutions: Combining ferrite beads with capacitors in single packages
Material innovation: Lead-free and low-temperature co-fired ceramic (LTCC) technologies
Automotive focus: AEC-Q qualified parts for EV/HEV power systems