Ferrite Beads and Chips

Part Number	Description / PDF	Quantity
MMZ1005D241CTD25 TDK Corporation	FERRITE BEAD 240 OHM 0402 1LN	1652
MMZ2012S800ATD25 TDK Corporation	FERRITE BEAD 80 OHM 0805 1LN	790
MPZ2012S331ATD25 TDK Corporation	FERRITE BEAD 330 OHM 0805 1LN	0
MPZ1608S181ATAH0 TDK Corporation	FERRITE BEAD 180 OHM 0603 1LN	53845
MMZ1608A222BTA00 TDK Corporation	FERRITE BEAD 2.2 KOHM 0603 1LN	21124
MPZ1005S330HT000 TDK Corporation	FERRITE BEAD 33 OHM 0402 1LN	52836
MPZ1608D300BTA00 TDK Corporation	FERRITE BEAD 30 OHM 0603 1LN	24896
MMZ1005Y301CT000 TDK Corporation	FERRITE BEAD 300 OHM 0402 1LN	10967
MMZ2012R121AT000 TDK Corporation	FERRITE BEAD 120 OHM 0805 1LN	14245
MPZ1005S121CTD25 TDK Corporation	FERRITE BEAD 120 OHM 0402 1LN	84298
MPZ0603S470CT000 TDK Corporation	FERRITE BEAD 47 OHM 0201 1LN	10494
MMZ1005Y121CT000 TDK Corporation	FERRITE BEAD 120 OHM 0402 1LN	13252
HF70ACB321611-T TDK Corporation	FERRITE BEAD 26 OHM 1206 1LN	21248
MMZ1608B601CTAH0 TDK Corporation	FERRITE BEAD 600 OHM 0603 1LN	26576
MMZ2012S301ATD25 TDK Corporation	FERRITE BEAD 300 OHM 0805 1LN	3924
MHF1608BAC182ATD25 TDK Corporation	EMC SUPPRESSION FILTER FOR SIGNA	4630
MMZ2012Y102BT000 TDK Corporation	FERRITE BEAD 1 KOHM 0805 1LN	9519
MMZ2012R301ATD25 TDK Corporation	FERRITE BEAD 300 OHM 0805 1LN	10925
MMZ1608R150ATA00 TDK Corporation	FERRITE BEAD 15 OHM 0603 1LN	6388
MMZ1005D220CTD25 TDK Corporation	FERRITE BEAD 22 OHM 0402 1LN	701

Ferrite Beads and Chips

1. Overview

Ferrite beads and chips are passive electronic components designed to suppress high-frequency noise in electrical circuits. Made from ferrite materials (iron oxide compounds), they act as low-pass filters by dissipating electromagnetic interference (EMI) as heat. Their importance in modern electronics lies in ensuring signal integrity, reducing radio-frequency interference (RFI), and complying with electromagnetic compatibility (EMC) standards. They are widely used in power supplies, communication systems, and high-speed digital circuits.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
High-Frequency Ferrite Beads	Optimized for GHz-range noise suppression, low core loss	5G transceivers, RF modules
Low-Frequency Ferrite Beads	Effective at MHz-range filtering, high impedance stability	Power supplies, motor drives
High-Current Chips	Designed for >1A applications, thermal stability	EV battery management systems
Multilayer Ferrite Chips	Stacked structure for broadband filtering	Smartphones, IoT devices

3. Structure and Composition

Typical construction includes:

Ferrite Core: Mn-Zn or Ni-Zn based ceramic material
Electrodes: Silver-palladium (AgPd) or copper-nickel (CuNi) terminations
Encapsulation: Epoxy or polymer coating for mechanical protection
Geometry: Available in cylindrical (beads) or rectangular (chips) formats

Advanced designs incorporate internal electrode layers to increase impedance density.

4. Key Technical Parameters

Parameter	Description	Importance
Impedance (Z)	100MHz @ 100 -10k	Determines noise suppression efficiency
Rated Current	100mA-10A	Affects circuit stability under load
Frequency Range	1MHz-10GHz	Defines operational bandwidth
DC Resistance (DCR)	0.1 -20	Impacts power loss and heating
Operating Temp.	-55 C to +150 C	Ensures reliability in extreme conditions

5. Application Areas

Consumer Electronics: Smartphones (camera module filtering), laptops (power line conditioning)
Automotive: EV charging systems (CAN bus noise suppression), ADAS sensors
Industrial: PLCs (programmable logic controllers), motor drives
Telecom: Base stations (RF front-end filtering), optical transceivers

6. Leading Manufacturers and Products

Manufacturer	Key Products	Specifications
Murata	BLSH series	0.7A, 600 @ 100MHz, EIA 0603
TDK	MMZ series	3.0A, 2200 @ 100MHz, EIA 1210
Coilcraft	0603LS series	1.5A, 500 @ 100MHz, 0.65mm height
W rth Elektronik	744300 series	2.0A, 1500 @ 100MHz, AEC-Q200 qualified

7. Selection Guidelines

Define frequency range: Choose Ni-Zn for >100MHz applications, Mn-Zn for low frequencies
Calculate current requirements: Select rated current 20% higher than maximum operating current
Impedance matching: Ensure Z 10 source/load impedance at target frequency
Package constraints: Prioritize chip format for space-limited PCB designs
Environmental factors: Consider temperature rating for automotive/industrial applications
Cost optimization: Balance performance needs with standard vs. high-end part pricing

8. Industry Trends

Key development directions include:

Miniaturization: Development of 0201/01005 chip sizes for wearable devices
High-frequency performance: Materials enabling stable operation beyond 10GHz
Integrated solutions: Combining ferrite beads with capacitors in single packages
Material innovation: Lead-free and low-temperature co-fired ceramic (LTCC) technologies
Automotive focus: AEC-Q qualified parts for EV/HEV power systems