Ferrite Beads and Chips

Part Number	Description / PDF	Quantity
HF30ACB201209-TD25 TDK Corporation	FERRITE BEAD 7 OHM 2012 1LN	0
MPZ0603S220HT000 TDK Corporation	CHIP BEADS FOR GENERAL SIGNAL LI	5559
MPZ1608S102ATD25 TDK Corporation	FERRITE BEAD 1 KOHM 0603 1LN	0
MMZ1005A222ET000 TDK Corporation	FERRITE BEAD 2.2 KOHM 0402 1LN	47955
MMZ1005A182ETD25 TDK Corporation	FERRITE BEAD 1.8 KOHM 0402 1LN	5463
MMZ0603F220CT000 TDK Corporation	FERRITE BEAD 22 OHM 0201 1LN	29461
MPZ1608R391ATD25 TDK Corporation	FERRITE BEAD 390 OHM 0603 1LN	835
MAF1005GAD701DT000 TDK Corporation	NOISE SUPPRESSION FILTER FOR AUD	24754
MMZ2012Y202BTD4C TDK Corporation	FERRITE BEAD	0
HF70RH12X15X7.3 TDK Corporation	FERRITE CYLINDRICAL 12 X 15	0
MMZ1005F560CT000 TDK Corporation	FERRITE BEAD 56 OHM 0402 1LN	0
MZA2010D241C TDK Corporation	FERRITE BEAD 240 OHM 0804 4LN	0
MZA3216S600A TDK Corporation	FERRITE BEAD 60 OHM 1206 4LN	0
ACB1608M-040-T TDK Corporation	FERRITE BEAD 40 OHM 0603 1LN	0
ACB1608L-060-T TDK Corporation	FERRITE BEAD 60 OHM 0603 1LN	0
MZA2010D680C TDK Corporation	FERRITE BEAD 68 OHM 0804 4LN	0
ACB2012M-040-T TDK Corporation	FERRITE BEAD 40 OHM 0805 1LN	0
MZA2010D330C TDK Corporation	FERRITE BEAD 33 OHM 0804 4LN	0
ACB1608M-080-T TDK Corporation	FERRITE BEAD 80 OHM 0603 1LN	0
MZA2010S241C TDK Corporation	FERRITE BEAD 240 OHM 0804 4LN	0

Ferrite Beads and Chips

1. Overview

Ferrite beads and chips are passive electronic components designed to suppress high-frequency noise in electrical circuits. Made from ferrite materials (iron oxide compounds), they act as low-pass filters by dissipating electromagnetic interference (EMI) as heat. Their importance in modern electronics lies in ensuring signal integrity, reducing radio-frequency interference (RFI), and complying with electromagnetic compatibility (EMC) standards. They are widely used in power supplies, communication systems, and high-speed digital circuits.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
High-Frequency Ferrite Beads	Optimized for GHz-range noise suppression, low core loss	5G transceivers, RF modules
Low-Frequency Ferrite Beads	Effective at MHz-range filtering, high impedance stability	Power supplies, motor drives
High-Current Chips	Designed for >1A applications, thermal stability	EV battery management systems
Multilayer Ferrite Chips	Stacked structure for broadband filtering	Smartphones, IoT devices

3. Structure and Composition

Typical construction includes:

Ferrite Core: Mn-Zn or Ni-Zn based ceramic material
Electrodes: Silver-palladium (AgPd) or copper-nickel (CuNi) terminations
Encapsulation: Epoxy or polymer coating for mechanical protection
Geometry: Available in cylindrical (beads) or rectangular (chips) formats

Advanced designs incorporate internal electrode layers to increase impedance density.

4. Key Technical Parameters

Parameter	Description	Importance
Impedance (Z)	100MHz @ 100 -10k	Determines noise suppression efficiency
Rated Current	100mA-10A	Affects circuit stability under load
Frequency Range	1MHz-10GHz	Defines operational bandwidth
DC Resistance (DCR)	0.1 -20	Impacts power loss and heating
Operating Temp.	-55 C to +150 C	Ensures reliability in extreme conditions

5. Application Areas

Consumer Electronics: Smartphones (camera module filtering), laptops (power line conditioning)
Automotive: EV charging systems (CAN bus noise suppression), ADAS sensors
Industrial: PLCs (programmable logic controllers), motor drives
Telecom: Base stations (RF front-end filtering), optical transceivers

6. Leading Manufacturers and Products

Manufacturer	Key Products	Specifications
Murata	BLSH series	0.7A, 600 @ 100MHz, EIA 0603
TDK	MMZ series	3.0A, 2200 @ 100MHz, EIA 1210
Coilcraft	0603LS series	1.5A, 500 @ 100MHz, 0.65mm height
W rth Elektronik	744300 series	2.0A, 1500 @ 100MHz, AEC-Q200 qualified

7. Selection Guidelines

Define frequency range: Choose Ni-Zn for >100MHz applications, Mn-Zn for low frequencies
Calculate current requirements: Select rated current 20% higher than maximum operating current
Impedance matching: Ensure Z 10 source/load impedance at target frequency
Package constraints: Prioritize chip format for space-limited PCB designs
Environmental factors: Consider temperature rating for automotive/industrial applications
Cost optimization: Balance performance needs with standard vs. high-end part pricing

8. Industry Trends

Key development directions include:

Miniaturization: Development of 0201/01005 chip sizes for wearable devices
High-frequency performance: Materials enabling stable operation beyond 10GHz
Integrated solutions: Combining ferrite beads with capacitors in single packages
Material innovation: Lead-free and low-temperature co-fired ceramic (LTCC) technologies
Automotive focus: AEC-Q qualified parts for EV/HEV power systems