Ferrite Beads and Chips

Part Number	Description / PDF	Quantity
MPZ1005A331ETD25 TDK Corporation	CHIP BEADS FOR POWER LINE, FOR A	23514
MPZ1005F330ET000 TDK Corporation	FERRITE BEAD 33 OHM 0402 1LN	7178
MMZ1005Y152CTD25 TDK Corporation	FERRITE BEAD 1.5 KOHM 0402 1LN	0
MAF1005FSA102AT000 TDK Corporation	FERRITE BEAD 1 KOHM 0402 1LN	11490
MPZ1608S221ATD25 TDK Corporation	FERRITE BEAD 220 OHM 0603 1LN	130806
MMZ1608Q471BTD25 TDK Corporation	FERRITE BEAD 470 OHM 0603 1LN	16000
MMZ0603S241CTD25 TDK Corporation	CHIP BEADS FOR AUTOMOTIVE, FOR G	29918
KMZ1608AHR252BTD25 TDK Corporation	FERRITE BEAD 2.5 KOHM 0603 1LN	5035
MMZ1608Y221BTD25 TDK Corporation	FERRITE BEAD 220 OHM 0603 1LN	7988
MMZ1608Y150BTA00 TDK Corporation	FERRITE BEAD 15 OHM 0603 1LN	29517
MPZ1608S221ATA00 TDK Corporation	FERRITE BEAD 220 OHM 0603 1LN	1165130
MMZ0603D121CT TDK Corporation	FERRITE BEAD 120 OHM 0201 1LN	0
MMZ1608Y152CTA00 TDK Corporation	FERRITE BEAD 1.5 KOHM 0603 1LN	7740
MMZ1005AFZ181VT000 TDK Corporation	FERRITE BEAD 180 OHM 0402 1LN	12036
MMZ1608Y152BTA00 TDK Corporation	FERRITE BEAD 1.5 KOHM 0603 1LN	122825
MMZ1608R300ATA00 TDK Corporation	FERRITE BEAD 30 OHM 0603 1LN	9646
MMZ1608A222BTD25 TDK Corporation	FERRITE BEAD 2.2 KOHM 0603 1LN	18111
VFS5045VA111 TDK Corporation	NOISE SUPPRESSION FILTER FOR HOM	2974
MPZ1608Y221BTA00 TDK Corporation	FERRITE BEAD 220 OHM 0603 1LN	11647
MMZ1005D121CT000 TDK Corporation	FERRITE BEAD 120 OHM 0402 1LN	730

Ferrite Beads and Chips

1. Overview

Ferrite beads and chips are passive electronic components designed to suppress high-frequency noise in electrical circuits. Made from ferrite materials (iron oxide compounds), they act as low-pass filters by dissipating electromagnetic interference (EMI) as heat. Their importance in modern electronics lies in ensuring signal integrity, reducing radio-frequency interference (RFI), and complying with electromagnetic compatibility (EMC) standards. They are widely used in power supplies, communication systems, and high-speed digital circuits.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
High-Frequency Ferrite Beads	Optimized for GHz-range noise suppression, low core loss	5G transceivers, RF modules
Low-Frequency Ferrite Beads	Effective at MHz-range filtering, high impedance stability	Power supplies, motor drives
High-Current Chips	Designed for >1A applications, thermal stability	EV battery management systems
Multilayer Ferrite Chips	Stacked structure for broadband filtering	Smartphones, IoT devices

3. Structure and Composition

Typical construction includes:

Ferrite Core: Mn-Zn or Ni-Zn based ceramic material
Electrodes: Silver-palladium (AgPd) or copper-nickel (CuNi) terminations
Encapsulation: Epoxy or polymer coating for mechanical protection
Geometry: Available in cylindrical (beads) or rectangular (chips) formats

Advanced designs incorporate internal electrode layers to increase impedance density.

4. Key Technical Parameters

Parameter	Description	Importance
Impedance (Z)	100MHz @ 100 -10k	Determines noise suppression efficiency
Rated Current	100mA-10A	Affects circuit stability under load
Frequency Range	1MHz-10GHz	Defines operational bandwidth
DC Resistance (DCR)	0.1 -20	Impacts power loss and heating
Operating Temp.	-55 C to +150 C	Ensures reliability in extreme conditions

5. Application Areas

Consumer Electronics: Smartphones (camera module filtering), laptops (power line conditioning)
Automotive: EV charging systems (CAN bus noise suppression), ADAS sensors
Industrial: PLCs (programmable logic controllers), motor drives
Telecom: Base stations (RF front-end filtering), optical transceivers

6. Leading Manufacturers and Products

Manufacturer	Key Products	Specifications
Murata	BLSH series	0.7A, 600 @ 100MHz, EIA 0603
TDK	MMZ series	3.0A, 2200 @ 100MHz, EIA 1210
Coilcraft	0603LS series	1.5A, 500 @ 100MHz, 0.65mm height
W rth Elektronik	744300 series	2.0A, 1500 @ 100MHz, AEC-Q200 qualified

7. Selection Guidelines

Define frequency range: Choose Ni-Zn for >100MHz applications, Mn-Zn for low frequencies
Calculate current requirements: Select rated current 20% higher than maximum operating current
Impedance matching: Ensure Z 10 source/load impedance at target frequency
Package constraints: Prioritize chip format for space-limited PCB designs
Environmental factors: Consider temperature rating for automotive/industrial applications
Cost optimization: Balance performance needs with standard vs. high-end part pricing

8. Industry Trends

Key development directions include:

Miniaturization: Development of 0201/01005 chip sizes for wearable devices
High-frequency performance: Materials enabling stable operation beyond 10GHz
Integrated solutions: Combining ferrite beads with capacitors in single packages
Material innovation: Lead-free and low-temperature co-fired ceramic (LTCC) technologies
Automotive focus: AEC-Q qualified parts for EV/HEV power systems